公开(公告)号：US20250036175A1

公开(公告)日：2025-01-30

申请号：US18786201

申请日：2024-07-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jongkil PARK ,  Bonghwan KIM ,  Joseph AHN ,  Hajoong YUN ,  Hui JEONG

IPC: G06F1/20

Abstract: According to an embodiment of the disclosure, there may be provided an electronic device comprising: a housing forming an exterior of the electronic device, a printed circuit board on which at least one component is disposed, and a heat dissipation member contacting the at least one component or contacting the at least one component through a thermally conductive material, and including a first plate, a second plate and a wick. The wick may be disposed on a second plate inside the heat dissipation member and include a first portion and a second portion. The first portion may be thicker than the second portion.