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公开(公告)号：US20250036175A1
公开(公告)日：2025-01-30
申请号：US18786201
申请日：2024-07-26
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jongkil PARK , Bonghwan KIM , Joseph AHN , Hajoong YUN , Hui JEONG
IPC: G06F1/20
Abstract: According to an embodiment of the disclosure, there may be provided an electronic device comprising: a housing forming an exterior of the electronic device, a printed circuit board on which at least one component is disposed, and a heat dissipation member contacting the at least one component or contacting the at least one component through a thermally conductive material, and including a first plate, a second plate and a wick. The wick may be disposed on a second plate inside the heat dissipation member and include a first portion and a second portion. The first portion may be thicker than the second portion.
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公开(公告)号：US20230026298A1
公开(公告)日：2023-01-26
申请号：US17869109
申请日：2022-07-20
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Joseph AHN , Kyungha KOO , Hongki MOON
Abstract: According to various embodiments of the disclosure, an electronic device may include: a housing, a display accommodated inside the housing, a support supporting the display and including a opening and a side wall surrounding the opening, and a heat dissipation structure at least a portion of which is positioned in the opening and bonded to the side wall, wherein the heat dissipation structure may include a heat dissipation layer having a first thermal conductivity and a protective layer having a second thermal conductivity, is the second thermal conductivity being lower than the first thermal conductivity, the protective layer covering at least a portion of the heat dissipation layer.
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公开(公告)号：US20250107035A1
公开(公告)日：2025-03-27
申请号：US18830384
申请日：2024-09-10
Applicant: Samsung Electronics Co., Ltd.
Inventor： Haejin LEE , Joseph AHN
Abstract: According to an embodiment, a wearable device includes: a frame including at least one inlet, a printed circuit board disposed in the frame, an electronic component disposed on the printed circuit board, and a shield can, disposed on the printed circuit board, at least partially surrounding the electronic component. The wearable device includes a housing, coupled with the shield can. The wearable device includes an actuator facing the housing. The actuator is configured to move air received through the at least one inlet toward the housing.
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Patent Agency Ranking
公开(公告)号：US20240385665A1
公开(公告)日：2024-11-21
申请号：US18788715
申请日：2024-07-30
Applicant: Samsung Electronics Co., Ltd.
Inventor： Joseph AHN , Youngchul LEE , Taehyeong KIM , Hongki MOON , Jongkil PARK
Abstract: An electronic device is provided. The electronic device includes a housing, a display disposed in the housing, a support member configured to support the display and including a first surface facing the display, a second surface facing the opposite direction to the first surface, and a first opening formed to penetrate at least one portion of the first surface and the second surface, a battery disposed on the second surface of the support member, wherein at least one portion of the battery faces the first opening, a printed circuit board disposed on the second surface of the support member and spaced from the battery, and a heat-radiating member configured to mediate heat transfer between the display and the printed circuit board, and including a first area and a second area coupled to the first area, wherein the first area is at least partially disposed to overlap the first surface, wherein the second area is at least partially disposed in the first opening, and wherein the at least a portion of the first area is coupled to the support member by laser welding.
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公开(公告)号：US20220330457A1
公开(公告)日：2022-10-13
申请号：US17435928
申请日：2021-09-01
Applicant: Samsung Electronics Co., Ltd.
Inventor： Joseph AHN , Kyungha KOO , Hongki MOON
Abstract: A vapor chamber and an electronic device are provided. The vapor chamber includes a first sheet including a first flat portion and a first bending portion bent, at an edge of the first flat portion, to be inclined at a first angle for the first flat portion, a second sheet including a second flat portion and a second bending portion bent, at an edge of the second flat portion, to be inclined at a second angle for the second flat portion, and a side portion formed by bonding the first bending portion and the second bending portion. A bonding surface between the first bending portion and the second bending portion may be disposed to be inclined from or perpendicular to an outer surface of the side portion.
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公开(公告)号：US20220167530A1
公开(公告)日：2022-05-26
申请号：US17534157
申请日：2021-11-23
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Joseph AHN , Kyungha KOO , Hongki MOON
IPC: H05K7/20 , B23K26/323 , F28D15/02 , B23K26/24
Abstract: An electronic device according to various embodiments may include: a housing, a printed circuit board disposed in the housing, an electrical element disposed on the printed circuit board, and a dissimilar metal structure disposed adjacent to the electrical element. The dissimilar metal structure may include a first metal portion comprising a first material, a second metal portion comprising a second material different from the first material, wherein at least a part of the second metal portion is bonded to the first metal portion, a vapor passage disposed in a space surrounded by the first metal portion and the second metal portion, and a wick disposed in contact with at least a part of the vapor passage in the space, wherein when viewed from above the dissimilar metal structure, a welded portion (e.g., bead) of the second metal portion, the welded portion being disposed at an interface between the first metal portion and the second metal portion, is disposed to surround at least a part of the first metal portion.
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公开(公告)号：US20230413484A1
公开(公告)日：2023-12-21
申请号：US18461141
申请日：2023-09-05
Applicant: Samsung Electronics Co., Ltd.
Inventor： Joseph AHN , Kyungha KOO , Hongki MOON
CPC classification number: H05K7/20336 , H05K7/2099 , G06F1/203 , H04M1/0266 , G06F2200/201
Abstract: An electronic device according to various embodiments comprises: a housing including a heat source and a thermal management chamber thermally coupled to the heat source; and a display disposed on the housing on the opposite side from the heat source. The thermal management chamber includes a working fluid, and is configured to generate bubbles in the working fluid at or above the boiling critical temperature of the working fluid. The thermal management chamber may include: a first wall located adjacent to the heat source and having a first hydrophilic surface; a second wall located on the opposite side from the first wall and spaced apart from the heat source, and having a second hydrophobic surface, and a plurality of third walls located between the first wall and the second wall.
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公开(公告)号：US20220272868A1
公开(公告)日：2022-08-25
申请号：US17673099
申请日：2022-02-16
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hongki MOON , Kyungha KOO , Yoonsun PARK , Youngjae YOU , Hyunjoo LEE , Joseph AHN
IPC: H05K7/20
Abstract: An electronic device may include: a housing, a support member disposed in an internal space of the housing and including a first surface and a second surface facing a direction opposite the first surface, wherein the support member includes a through hole in at least a portion thereof, and a vapor chamber disposed through at least a portion of the through-hole, wherein the vapor chamber may include: a first plate including a first plate portion including a plurality of pillars and a first flange portion extending along an edge of the first plate portion to have a first width, a second plate having a size corresponding to the first plate portion and including a second plate portion including a recess and a second flange portion extending along an edge of the second plate portion to have a second width less than the first width, and at least one wick disposed in the recess, wherein the wick may be accommodated through a closed space defined through coupling of the first plate and the second plate.
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