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公开(公告)号:US20230384239A1
公开(公告)日:2023-11-30
申请号:US18446837
申请日:2023-08-09
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Doyoung YOON , Jeongho AHN , Dongryul LEE , Dongchul IHM , Chungsam JUN
IPC: G01N21/95 , H01L21/66 , G01N21/88 , G01N21/956
CPC classification number: G01N21/9501 , H01L22/12 , G01N21/8806 , G01N21/956
Abstract: A semiconductor wafer inspection system includes a wafer chuck disposed inside a chamber and on which a wafer is disposed, a light source configured to emit light for inspecting a pattern on the wafer to the wafer, an inspection controller configured to control the driving of the light source, a cooling gas gun disposed adjacent to the light source and configured to spray a cooling gas on a surface of the wafer, and a cooling controller configured to supply cooling air to the wafer chuck before light is emitted to the wafer and supply the cooling gas to the cooling gas gun.
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公开(公告)号:US20230062430A1
公开(公告)日:2023-03-02
申请号:US17890557
申请日:2022-08-18
Applicant: Samsung Electronics Co., Ltd.
Inventor: Ami MA , Hyeonkyun NOH , Shinwook YI , Dongchul IHM , Kyubaik CHANG , Jaehoon JEONG
IPC: G06N20/00
Abstract: A device structure simulation apparatus includes a memory storing a device structure simulation program and a processor configured to execute the device structure simulation program stored in the memory. By executing the device structure simulation program, the device structure simulation apparatus is further configured to receive spectrum data of a target device, generate an input data set by performing preprocessing on the spectrum data, and train a model based on the input data set such that the model is configured to predict a structure of the target device. The preprocessing including selecting a certain basis function based on the spectrum data and separating the spectrum data into sets of certain basis functions, and the model includes at least one sub model.
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公开(公告)号:US20230123710A1
公开(公告)日:2023-04-20
申请号:US17501318
申请日:2021-10-14
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Doyoung YOON , Jeongho AHN , Dongryul LEE , Dongchul IHM , Chungsam JUN
IPC: G01N21/95 , G01N21/956 , G01N21/88 , H01L21/66
Abstract: A semiconductor wafer inspection system includes a wafer chuck disposed inside a chamber and on which a wafer is disposed, a light source configured to emit light for inspecting a pattern on the wafer to the wafer, an inspection controller configured to control the driving of the light source, a cooling gas gun disposed adjacent to the light source and configured to spray a cooling gas on a surface of the wafer, and a cooling controller configured to supply cooling air to the wafer chuck before light is emitted to the wafer and supply the cooling gas to the cooling gas gun.
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