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公开(公告)号：US10365765B2
公开(公告)日：2019-07-30
申请号：US15266113
申请日：2016-09-15
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Sangwoo Lee , Donggyu Kim , Youngjoon Ko , Sangyup Lee , Youngseok Lim
IPC: G06F3/041 , G06F3/0485 , G06F3/0486 , G06F3/0488
Abstract: A method for processing a touch or a gesture input made though the touch panel of the electronic device is provided. An electronic device includes a display having a touch panel for receiving a touch or a gesture input, a processor which is electrically connected to the display, and a memory which is electrically connected to the processor, wherein the memory stores instructions, executable to configure the processor to receive the gesture input made through the touch panel, to detect touch coordinates corresponding to the gesture input on the touch panel, to determine predictive coordinates corresponding to the touch coordinates, to determine whether to compensate the predictive coordinates based on a movement direction of the gesture input, to determine target coordinates corresponding to the predictive coordinates based on a movement speed of the gesture input, and to display at least one object at the target coordinates on the display.
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公开(公告)号：US20250029885A1
公开(公告)日：2025-01-23
申请号：US18416151
申请日：2024-01-18
Applicant: Samsung Electronics Co., Ltd.
Inventor： Donggyu Kim
IPC: H01L23/36 , H01L23/00 , H01L23/38 , H01L23/498 , H01L23/538 , H01L23/64
Abstract: A semiconductor package may include a package substrate, a semiconductor chip on the package substrate, and one or more outer terminals below the package substrate. The one or more outer terminals may include at least one signal terminal delivering an operation signal to the semiconductor chip and at least one power terminal supplying an electric power to the semiconductor chip. The package substrate may include an insulating portion, one or more interconnection patterns provided in the insulating portion to electrically connect the semiconductor chip to the at least one signal terminal, and a heat-dissipation pattern provided in the insulating portion to electrically connect the semiconductor chip to the at least one power terminal. The heat-dissipation pattern may include at least one conductive pattern and at least one thermoelectric pattern, which are connected in series in a direction from the one or more outer terminals toward the semiconductor chip.
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公开(公告)号：US10312100B2
公开(公告)日：2019-06-04
申请号：US15334684
申请日：2016-10-26
Inventor： Wonhee Ko , Hyowon Kim , Jiyeon Ku , Donggyu Kim , Seunghwa Ryu , Seongjun Jeong
IPC: H01L21/20 , H01L21/306 , H01L21/02 , H01L21/308 , H01L29/41
Abstract: A conductor including a graphene layer and a method of manufacturing the conductor are provided. The conductor may further include a nano pattern disposed on a substrate, and the graphene layer may be formed on the nano pattern. The nano pattern may have any various shapes and include a material that interacts with the graphene layer. The nano pattern and the graphene layer included in the conductor may interact with each other, such that the electric characteristics of the conductor are maintained while the heat transfer characteristics thereof are improved.
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公开(公告)号：US11216070B2
公开(公告)日：2022-01-04
申请号：US16476993
申请日：2018-01-05
Applicant: Samsung Electronics Co., Ltd.
Inventor： Yudong Bae , Jeongseok Lee , Jaeyoung Huh , Donggyu Kim , Ilyoung Kim , Kwonho Song , Yanghee Lee
Abstract: Various embodiments of the present invention relate to a method for controlling an actuator. The present invention can detect a haptic generation event through a sensor unit, check data of an actuator and data of a human receptor stored in a memory in response to the haptic generation event, calculate a driving voltage of the actuator on the basis of the checked data of the actuator and the checked data of the human receptor, and drive the actuator with the calculated driving voltage. Other embodiments are also possible.
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