公开(公告)号：US11927640B2

公开(公告)日：2024-03-12

申请号：US16973117

申请日：2019-06-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seongho Han ,  Bookeun Oh ,  Gilho Kim ,  Junyoung Oh ,  Sungun Wi ,  Jaeyeon Lee

IPC: G01R31/367 ,  G01R31/371 ,  G01R31/382 ,  G06N20/00

CPC classification number: G01R31/367 ,  G01R31/371 ,  G01R31/382 ,  G06N20/00

Abstract: An electronic device according to various embodiments of the present invention includes: a memory which stores one or more mapping parameters that indicate the correlation between a voltage change amount and the state of health (SOH) of the battery; and a processor, wherein the processor can be set to: detect that an external device for charging the battery is connected to the electronic device; charge the battery by using a charging current supplied from the external device; decide on at least one mapping parameter among the one or more mapping parameters on the basis of at least the charging current; check the voltage change amount of the battery while the battery is being charged; and acquire the SOH of the battery at least partially on the basis of the at least one mapping parameter and the voltage change amount.

公开(公告)号：US12287684B2

公开(公告)日：2025-04-29

申请号：US17900306

申请日：2022-08-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kiyoun Jang ,  Gisoo Lim ,  Changryong Heo ,  Gilho Kim ,  Juho Song ,  Kwanghoon Choi

IPC: G06F1/16 ,  G06F1/20

Abstract: The electronic device includes a display including a first area and a second area, a first housing configured to support the first area and to form a first space, a second housing configured to support the second area and to form a second space, a hinge structure configured to foldably connect the first housing and the second housing based on a folding axis to be in a first state in which the first and second areas form substantially a same plane or in a second state in which the first and second areas face each other, and a heat transfer member provided to extend from the first space to the second space through the hinge structure and configured to perform a heat transfer between the first space and the second space.