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公开(公告)号：US10854938B2
公开(公告)日：2020-12-01
申请号：US16116225
申请日：2018-08-29
Applicant: Samsung Electronics Co., Ltd.
Inventor： Young-Jong Kim , Dongsik Shin , Jonghwa Kim , Hae-Gweon Park , Byungtae Yoon , Jong Wook Zeong , Soon-Ho Hwang
Abstract: A phase shifter is disclosed and includes a first substrate comprising a phase change line; and a second substrate comprising an input line connected to an input port, a first output line connected to a first output port, a second output line connected to a second output port, and a connection line connecting the first output line and the second output line. The first substrate is disposed to face the second substrate and to be overlaid at a predetermined distance from the second substrate. A phase of a signal passing through a first portion of the phase change line changes by a first value according to a movement of the first substrate. The signal is branched into a first signal to be transmitted to the first output port and a second signal to be transmitted to the second output port.
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公开(公告)号：US11349184B2
公开(公告)日：2022-05-31
申请号：US16651843
申请日：2018-09-11
Applicant: Samsung Electronics Co., Ltd.
Inventor： Young-Jong Kim , Dongsik Shin , Jonghwa Kim , Hae-Gweon Park , Byungtae Yoon , Jong Wook Zeong , Soon-Ho Hwang
Abstract: The present disclosure relates to a pre-5th-Generation (5G) or 5G communication system to be provided for supporting higher data rates beyond 4th-Generation (4G) communication system such as long-term evolution (LTE). A phase shifter device according to various embodiments of the present disclosure may include: a first board configured to comprise a phase changing rail; and a second board configured to comprise an input rail connected to an input port, a first output rail connected to a first output port, a second output rail connected to a second output port, and a connection rail connecting the first output rail with the second output rail. The first board may be disposed to be spaced a predetermined distance apart from the second board so as to face and overlay the second board. The phase of a signal passing through a first section of the connection rail may vary by a first value depending on the rotation of the first board. The signal may be divided into a first signal transmitted to the first output port and a second signal transmitted to the second output port.
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公开(公告)号：US20170074955A1
公开(公告)日：2017-03-16
申请号：US15042485
申请日：2016-02-12
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kyung Moo CHOI , Hae-Gweon Park , Ju Hyung Lee
IPC: G01R33/34
CPC classification number: G01R33/34015 , G01R33/34007 , G01R33/3415
Abstract: An RF coil has an improved structure to prevent an excessive heat from being transferred to an object, and a magnetic resonance imaging apparatus includes the same. The MRI apparatus includes an RF coil configured to receive an RF signal, wherein the RF coil may include a first cover configured to allow thermal insulation material to be injected into the inside thereof, a second cover configured to allow thermal insulation material to be injected into the inside thereof and detachably coupled to the first cover to form an inner space with the first cover, and at least one circuit board disposed in the inner space and on which a circuit element configured to receive the RF signal is mounted.
Abstract translation: RF线圈具有改进的结构，以防止过多的热被传送到物体，并且磁共振成像设备包括该RF线圈。 MRI装置包括被配置为接收RF信号的RF线圈，其中RF线圈可以包括构造成允许将绝热材料注入其内部的第一盖，构造成允许将绝热材料注入的第二盖 其内部并且可拆卸地联接到第一盖以形成具有第一盖的内部空间，以及布置在内部空间中并且被配置为接收RF信号的电路元件的至少一个电路板。
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公开(公告)号：US10215817B2
公开(公告)日：2019-02-26
申请号：US15042485
申请日：2016-02-12
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kyung Moo Choi , Hae-Gweon Park , Ju Hyung Lee
IPC: G01R33/34 , G01R33/3415
Abstract: An RF coil has an improved structure to prevent an excessive heat from being transferred to an object, and a magnetic resonance imaging apparatus includes the same. The MRI apparatus includes an RF coil configured to receive an RF signal, wherein the RF coil may include a first cover configured to allow thermal insulation material to be injected into the inside thereof, a second cover configured to allow thermal insulation material to be injected into the inside thereof and detachably coupled to the first cover to form an inner space with the first cover, and at least one circuit board disposed in the inner space and on which a circuit element configured to receive the RF signal is mounted.
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