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公开(公告)号:US11699375B1
公开(公告)日:2023-07-11
申请号:US17968407
申请日:2022-10-18
Applicant: Samsung Electronics Co., Ltd.
Inventor: Hiroki Fujii , Jae-Hyun Yoo
CPC classification number: G09G3/20 , H01L29/1041 , G09G2310/0291
Abstract: A semiconductor device includes a semiconductor substrate including an active region defined in a well impurity layer having a first conductivity type, a gate electrode on the active region, and a gate insulating layer between the gate electrode and the active region. The active region includes a source region and a drain region at sides of the gate electrode, the source region and the drain region having a second conductivity type, a channel region between the source and drain regions, the channel region having the first conductivity type, a first halo region in contact with the source region and a second halo region in contact with the drain region, the first halo region and the second halo region having the first conductivity type, and a slit well region between the first and second halo regions, the slit well region having the first conductivity type.
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公开(公告)号:US11908807B2
公开(公告)日:2024-02-20
申请号:US17574212
申请日:2022-01-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Huichul Shin , Hyungjin Lee , Jinhong Park , Mingeun Song , Euiyoung Jeong , Hiroki Fujii
IPC: H01L23/552 , H01L21/82 , H01L21/78
CPC classification number: H01L23/552
Abstract: A semiconductor device is provided. The semiconductor device includes: a substrate with first-conductivity-type impurities; first and second active regions provided on the substrate; a first deep element isolation layer surrounding the first active region; a second deep element isolation layer surrounding the second active region; a suction region surrounding the first and second deep element isolation layers, the suction region including the first-conductivity-type impurities; a well region provided in the substrate between the first and second active regions, the well region including second-conductivity-type impurities different from the first-conductivity-type impurities; a shallow element isolation layer provided between the suction region and the well region; and a guard structure connected to the suction region. The substrate includes a signal path portion that is provided between a top surface of the substrate and the well region, and surrounds an upper portion of the well region.
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