公开(公告)号：US10896879B2

公开(公告)日：2021-01-19

申请号：US16201708

申请日：2018-11-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kun Sil Lee ,  Dong Kwan Kim ,  Bo Ram Kang ,  Ho Geon Song ,  Won Keun Kim

IPC: H01L23/552 ,  G01N23/18

Abstract: A semiconductor package includes a semiconductor package substrate. An insulating layer is disposed on the semiconductor package substrate. A semiconductor chip is disposed on the semiconductor package substrate and is covered by the insulating layer. A reflective layer is disposed on the insulating layer and is spaced apart from the semiconductor chip. The reflective layer is configured to selectively transmit radiation through to the insulating layer. A protective layer is disposed on the reflective layer.

公开(公告)号：US20210005576A1

公开(公告)日：2021-01-07

申请号：US16822693

申请日：2020-03-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyoungsoo Kim ,  Sunwon Kang ,  Seungduk Baek ,  Ho Geon Song ,  Kyung Suk Oh

IPC: H01L25/065 ,  H01L23/00 ,  H01L25/00

Abstract: A semiconductor package includes a first die including a signal region and a peripheral region bordering the signal region and having first vias in the peripheral region, a second die stacked on the first die and having second vias at positions corresponding to the first vias in the peripheral region, and first connection terminals between the first die and the second die that are configured to connect the second vias to the first vias, respectively. The peripheral region includes first regions and second regions configured to transmit different signals, which are alternately arranged in a first direction. The first vias are arranged in at least two rows along a second direction intersecting the first direction in each of the first and second regions.

公开(公告)号：US11495576B2

公开(公告)日：2022-11-08

申请号：US16822693

申请日：2020-03-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyoungsoo Kim ,  Sunwon Kang ,  Seungduk Baek ,  Ho Geon Song ,  Kyung Suk Oh

IPC: H01L23/498 ,  H01L23/48 ,  H01L23/544 ,  H01L25/065 ,  H01L23/00 ,  H01L25/00

Abstract: A semiconductor package includes a first die including a signal region and a peripheral region bordering the signal region and having first vias in the peripheral region, a second die stacked on the first die and having second vias at positions corresponding to the first vias in the peripheral region, and first connection terminals between the first die and the second die that are configured to connect the second vias to the first vias, respectively. The peripheral region includes first regions and second regions configured to transmit different signals, which are alternately arranged in a first direction. The first vias are arranged in at least two rows along a second direction intersecting the first direction in each of the first and second regions.