公开(公告)号：US10153219B2

公开(公告)日：2018-12-11

申请号：US15629072

申请日：2017-06-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyung-jun Jeon ,  Nae-in Lee ,  Byung-Iyul Park

IPC: H01L23/498 ,  H01L23/538 ,  H01L23/045 ,  H01L23/047 ,  H01L25/10 ,  H01L23/00 ,  H01L23/31

Abstract: A semiconductor package of a package on package type includes a lower package including a printed circuit board (PCB) substrate including a plurality of base layers and a cavity penetrating the plurality of base layers, a first semiconductor chip in the cavity. a redistribution structure on a first surface of the PCB substrate and on an active surface of the first semiconductor chip, a first cover layer covering the redistribution structure, and the second cover layer covering a second surface of the PCB substrate and an inactive surface of the first semiconductor chip, and an upper package on the second cover layer of the lower package and including a second semiconductor chip.