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公开(公告)号:US08557664B2
公开(公告)日:2013-10-15
申请号:US13644166
申请日:2012-10-03
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kwan-sik Cho , Kwang-youl Chun , Jae-man Yoon , Bong-soo Kim
IPC: H01L21/336
CPC classification number: H01L21/768
Abstract: A method of fabricating a semiconductor device using a recess channel array is disclosed. A substrate is provided having a first region and a second region, including a first transistor in the first region including a first gate electrode partially filling a trench, and source and drain regions that are formed at both sides of the trench, and covered by a first insulating layer. A first conductive layer is formed on the substrate. A contact hole through which the drain region is exposed is formed by patterning the first conductive layer and the first insulating layer. A contact plug is formed that fills the contact hole. A bit line is formed that is electrically connected to the drain region through the contact plug, and simultaneously a second gate electrode is formed in the second region by patterning the first conductive layer.
Abstract translation: 公开了一种使用凹槽通道阵列制造半导体器件的方法。 提供了具有第一区域和第二区域的衬底,该第一区域和第二区域包括第一区域中的第一晶体管,该第一区域包括部分地填充沟槽的第一栅电极,以及形成在沟槽两侧的源区和漏区, 第一绝缘层。 在基板上形成第一导电层。 通过图案化第一导电层和第一绝缘层来形成漏极区域露出的接触孔。 形成一个填充接触孔的接触塞。 形成通过接触插塞电连接到漏极区的位线,同时通过对第一导电层进行构图而在第二区域中形成第二栅电极。
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公开(公告)号:US20130026564A1
公开(公告)日:2013-01-31
申请号:US13644166
申请日:2012-10-03
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kwan-sik Cho , Kwang-youl Chun , Jae-man Yoon , Bong-soo Kim
IPC: H01L27/088 , H01L29/78
CPC classification number: H01L21/768
Abstract: A method of fabricating a semiconductor device using a recess channel array is disclosed. A substrate is provided having a first region and a second region, including a first transistor in the first region including a first gate electrode partially filling a trench, and source and drain regions that are formed at both sides of the trench, and covered by a first insulating layer. A first conductive layer is formed on the substrate. A contact hole through which the drain region is exposed is formed by patterning the first conductive layer and the first insulating layer. A contact plug is formed that fills the contact hole. A bit line is formed that is electrically connected to the drain region through the contact plug, and simultaneously a second gate electrode is formed in the second region by patterning the first conductive layer.
Abstract translation: 公开了一种使用凹槽通道阵列制造半导体器件的方法。 提供了具有第一区域和第二区域的衬底,该第一区域和第二区域包括第一区域中的第一晶体管,该第一区域包括部分地填充沟槽的第一栅电极,以及形成在沟槽两侧的源区和漏区, 第一绝缘层。 在基板上形成第一导电层。 通过图案化第一导电层和第一绝缘层来形成漏极区域露出的接触孔。 形成一个填充接触孔的接触塞。 形成通过接触插塞电连接到漏极区的位线,同时通过对第一导电层进行构图而在第二区域中形成第二栅电极。
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