Methods of fabricating semiconductor devices
    1.
    发明授权
    Methods of fabricating semiconductor devices 有权
    制造半导体器件的方法

    公开(公告)号:US08557664B2

    公开(公告)日:2013-10-15

    申请号:US13644166

    申请日:2012-10-03

    CPC classification number: H01L21/768

    Abstract: A method of fabricating a semiconductor device using a recess channel array is disclosed. A substrate is provided having a first region and a second region, including a first transistor in the first region including a first gate electrode partially filling a trench, and source and drain regions that are formed at both sides of the trench, and covered by a first insulating layer. A first conductive layer is formed on the substrate. A contact hole through which the drain region is exposed is formed by patterning the first conductive layer and the first insulating layer. A contact plug is formed that fills the contact hole. A bit line is formed that is electrically connected to the drain region through the contact plug, and simultaneously a second gate electrode is formed in the second region by patterning the first conductive layer.

    Abstract translation: 公开了一种使用凹槽通道阵列制造半导体器件的方法。 提供了具有第一区域和第二区域的衬底,该第一区域和第二区域包括第一区域中的第一晶体管,该第一区域包括部分地填充沟槽的第一栅电极,以及形成在沟槽两侧的源区和漏区, 第一绝缘层。 在基板上形成第一导电层。 通过图案化第一导电层和第一绝缘层来形成漏极区域露出的接触孔。 形成一个填充接触孔的接触塞。 形成通过接触插塞电连接到漏极区的位线,同时通过对第一导电层进行构图而在第二区域中形成第二栅电极。

    Methods of Fabricating Semiconductor Devices
    2.
    发明申请
    Methods of Fabricating Semiconductor Devices 有权
    制造半导体器件的方法

    公开(公告)号:US20130026564A1

    公开(公告)日:2013-01-31

    申请号:US13644166

    申请日:2012-10-03

    CPC classification number: H01L21/768

    Abstract: A method of fabricating a semiconductor device using a recess channel array is disclosed. A substrate is provided having a first region and a second region, including a first transistor in the first region including a first gate electrode partially filling a trench, and source and drain regions that are formed at both sides of the trench, and covered by a first insulating layer. A first conductive layer is formed on the substrate. A contact hole through which the drain region is exposed is formed by patterning the first conductive layer and the first insulating layer. A contact plug is formed that fills the contact hole. A bit line is formed that is electrically connected to the drain region through the contact plug, and simultaneously a second gate electrode is formed in the second region by patterning the first conductive layer.

    Abstract translation: 公开了一种使用凹槽通道阵列制造半导体器件的方法。 提供了具有第一区域和第二区域的衬底,该第一区域和第二区域包括第一区域中的第一晶体管,该第一区域包括部分地填充沟槽的第一栅电极,以及形成在沟槽两侧的源区和漏区, 第一绝缘层。 在基板上形成第一导电层。 通过图案化第一导电层和第一绝缘层来形成漏极区域露出的接触孔。 形成一个填充接触孔的接触塞。 形成通过接触插塞电连接到漏极区的位线,同时通过对第一导电层进行构图而在第二区域中形成第二栅电极。

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