公开(公告)号：US20140127442A1

公开(公告)日：2014-05-08

申请号：US13935652

申请日：2013-07-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jong-In RYU ,  Myung-Gon KIM ,  Seung-Taek OH

IPC: H05K5/00

CPC classification number: H05K5/0086 ,  C03C17/42 ,  C03C2217/77 ,  C03C2218/33 ,  H04M1/0266 ,  H04M1/0283

Abstract: A window member and a method for fabricating the same. The window member includes a glass member, a semi-transparent printed layer formed on the glass member, and a metal or metal oxide layer formed on the semi-transparent printed layer. In some embodiments, the semi-transparent printed layer includes embossments formed on a surface thereof facing the metal or metal oxide layer, or contains an additive to generate virtual embossments.

Abstract translation: 窗构件及其制造方法。 窗构件包括玻璃构件，形成在玻璃构件上的半透明印刷层和形成在半透明印刷层上的金属或金属氧化物层。 在一些实施例中，半透明印刷层包括在其面向金属或金属氧化物层的表面上形成的压花，或包含产生虚拟压花的添加剂。

公开(公告)号：US20160113135A1

公开(公告)日：2016-04-21

申请号：US14849949

申请日：2015-09-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Myung-Gon KIM ,  Jong-In RYU ,  Min-Su CHANG

IPC: H05K5/03 ,  C03B27/00 ,  B32B37/12 ,  B32B37/10 ,  B32B7/12 ,  B32B17/10 ,  B32B37/18 ,  B29D99/00

CPC classification number: B32B37/12 ,  B29D99/006 ,  B29K2709/08 ,  B29L2031/3481 ,  B32B3/04 ,  B32B7/12 ,  B32B17/06 ,  B32B17/10018 ,  B32B17/10816 ,  B32B17/10889 ,  B32B37/10 ,  B32B37/182 ,  B32B2457/00 ,  C03B27/00 ,  H04M1/0202 ,  H04M1/0283 ,  H04M1/185

Abstract: An electronic device and method of fabricating an exterior member thereof are provided. The electronic device includes a basic member disposed on an outside of the electronic device and having an outer surface that is at least partially curved, and a glass film at least partially laminated to the outer surface of the basic member.

Abstract translation: 提供了一种制造其外部构件的电子装置和方法。 电子设备包括设置在电子设备的外部并具有至少部分弯曲的外表面的基本构件和至少部分地层叠到基础构件的外表面的玻璃膜。

公开(公告)号：US20160255735A1

公开(公告)日：2016-09-01

申请号：US15044748

申请日：2016-02-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Soon-Ho HAN ,  Jong-In RYU ,  Byoung-Uk YOON

IPC: H05K5/03 ,  H05K5/00

CPC classification number: H05K5/03 ,  B32B17/06 ,  B32B2457/208 ,  G02F1/133351 ,  G06F1/1626 ,  G06F1/1637 ,  G06F1/1647 ,  H04M11/00 ,  H05K5/0017 ,  H05K5/0086

Abstract: An electronic device on which an exterior surface mounting member is mounted is provided. The electronic device includes an external housing including a first plate and a second plate that is directed opposite to the first plate, and at least one electronic component that is included within the external housing. The first plate may include a transparent plate including a first surface that forms an outer surface of the first plate and a second surface that is directed opposite to the first surface, and a structure that is interposed between the transparent plate and the second plate, and includes a third surface that faces the first plate and a fourth surface that is formed opposite to the third surface, the structure containing a transparent or translucent material.

Abstract translation: 提供安装有外表面安装构件的电子装置。 电子设备包括外壳，其包括与第一板相对的第一板和第二板，以及包括在外壳内的至少一个电子元件。 第一板可以包括透明板，其包括形成第一板的外表面的第一表面和与第一表面相对的第二表面，以及介于透明板和第二板之间的结构，以及 包括面对第一板的第三表面和与第三表面相对形成的第四表面，该结构包含透明或半透明材料。