SEMICONDUCTOR DEVICE INCLUDING SPACER STRUCTURE HAVING AIR GAP

    公开(公告)号:US20240215225A1

    公开(公告)日:2024-06-27

    申请号:US18391835

    申请日:2023-12-21

    CPC classification number: H10B12/482 H01L21/764 H10B12/0335 H10B12/315

    Abstract: A semiconductor device includes a line structure on the lower structure and including a conductive pattern and an insulating capping pattern on the conductive pattern, a contact structure including a lower portion adjacent to a side surface of the line structure and an upper portion on the lower portion, a spacer structure between a side surface of the lower portion of the contact structure and the side surface of the line structure, an insulating separation pattern on the spacer structure, and a protective layer between the upper portion of the contact structure and the insulating separation pattern. The spacer structure includes an internal spacer, an external spacer, and an air gap between the internal spacer and the external spacer. Regions of the internal spacer and the external spacer exposed by the air gap include an oxide. The insulating separation pattern seals at least a portion of an upper portion of the air gap.

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