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公开(公告)号:US20200075524A1
公开(公告)日:2020-03-05
申请号:US16356224
申请日:2019-03-18
Applicant: Samsung Electronics Co., Ltd.
Inventor: Ju Bin SEO , Dong Hoon LEE , Ju Il CHOI , Su Jeong PARK , Dong Chan LIM
Abstract: A semiconductor device including a substrate including a first conductive pad on a first surface thereof, at least one first bump structure on the first conductive pad, the first bump structure including a first connecting member and a first delamination prevention layer, the first delamination prevention layer on the first connecting member and having a greater hardness than the first connecting member, and a first encapsulant above the first surface of the substrate and surrounding the first bump structure may be provided.