公开(公告)号：US20250125163A1

公开(公告)日：2025-04-17

申请号：US18778009

申请日：2024-07-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyo-Eun LEE ,  Young Chul KWON

IPC: H01L21/67 ,  H01L21/687

Abstract: An apparatus for dicing a wafer includes a stage configured to receive a wafer, and move the wafer in a first direction, and a plurality of laser heads above the stage along the first direction, and as the stage moves the wafer in the first direction, the plurality of laser heads are configured to emit a plurality of laser beams onto the wafer along a plurality of cutting lines, the plurality of cutting lines extending in the first direction and each cutting line spaced apart from other cutting lines in a second direction, the second direction perpendicular to the first direction.