公开(公告)号：US20250033143A1

公开(公告)日：2025-01-30

申请号：US18662272

申请日：2024-05-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dong Ju PARK ,  Young Chul KWON ,  Jae Heung LEE ,  Nam-Tae HEO

IPC: B23K26/042 ,  B23K26/03 ,  B23K26/064 ,  B23K26/53

Abstract: An apparatus for substrate dicing includes: a laser beam emitter outputting a laser beam; a stage on which a test substrate is loaded, wherein the test substrate includes a sample substrate and a test film; a laser beam modulator modulating the laser beam to output a modulated beam; an optical system transferring the modulated beam into the sample substrate; a camera capturing the modulated beam that is reflected from the test film; and a controller generating a control signal based on at least one of a reaction point being formed in the test film or a shape of the reaction point of the test film being biased toward one side with respect to a central axis, wherein the laser beam modulator is configured to modulate the laser beam based on the control signal to output the modulated beam.

公开(公告)号：US20250125163A1

公开(公告)日：2025-04-17

申请号：US18778009

申请日：2024-07-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyo-Eun LEE ,  Young Chul KWON

IPC: H01L21/67 ,  H01L21/687

Abstract: An apparatus for dicing a wafer includes a stage configured to receive a wafer, and move the wafer in a first direction, and a plurality of laser heads above the stage along the first direction, and as the stage moves the wafer in the first direction, the plurality of laser heads are configured to emit a plurality of laser beams onto the wafer along a plurality of cutting lines, the plurality of cutting lines extending in the first direction and each cutting line spaced apart from other cutting lines in a second direction, the second direction perpendicular to the first direction.

公开(公告)号：US20230102791A1

公开(公告)日：2023-03-30

申请号：US17740494

申请日：2022-05-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung Ho JANG ,  Min Hwan SEO ,  Jang Hwi LEE ,  Young Chul KWON ,  Sang Woo BAE ,  Akinori OKUBO ,  Jung Chul LEE ,  Won Don JOO

IPC: B23K26/53 ,  B23K26/38 ,  B23K26/03

Abstract: A method for dicing a substrate includes setting a target height for forming a first reforming region inside a target substrate, the target height being a distance from an upper surface of the target substrate to the first reforming region; irradiating a laser beam to a first sample substrate including a first film and a second film being in contact with the first film, and setting a target condition on the basis of a sample condition that results in forming a condensing point of the laser beam on an upper surface of the first film being in contact with the second film; and irradiating the target substrate with the laser beam according to the target condition to form the first reforming region inside the target substrate, wherein a thickness of the second film is the target height.