Mobile devices and methods controlling power in mobile devices

    公开(公告)号:US11537154B2

    公开(公告)日:2022-12-27

    申请号:US17460389

    申请日:2021-08-30

    Abstract: A mobile device includes; a PCB including a first side and a second side, a PMIC generating power supply voltages and mounted on the second side of the PCB, a package substrate mounted on the first side of PCB using first interconnects, an IC mounted on the first side of the package substrate, LDO regulators mounted on the second side of the package substrate and disposed between the first interconnects, and high density capacitors disposed between each of the LDO regulators and the second side of the package substrate, wherein the PCB includes first electrical paths connecting the PMIC to the LDO regulators, and the package substrate includes second electrical paths connecting the LDO regulators to the IC.

    PROBE CARD AND SEMICONDUCTOR DEVICE INSPECTION SYSTEM INCLUDING THE SAME

    公开(公告)号:US20240353442A1

    公开(公告)日:2024-10-24

    申请号:US18643294

    申请日:2024-04-23

    CPC classification number: G01R1/045 G01R1/0466 G01R1/06722

    Abstract: Provided are a probe card and a semiconductor device inspection system including the same. A probe card includes a socket structure including at least one socket, and a plane structure located on the socket structure. The at least one socket includes at least one RF signal pin through which a signal of a radio frequency (RF) band is transmitted, and at least one ground pin. The plane structure includes an RF plane including at least one RF signal line electrically connected to the at least one RF signal pin, and a ground plane electrically connected to the at least one ground pin, the ground plane being located between the RF plane and the socket structure.

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