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公开(公告)号:US11537154B2
公开(公告)日:2022-12-27
申请号:US17460389
申请日:2021-08-30
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Kyoungmin Lee , Changsoo Kim , Byungchul Jeon , Junghun Heo , Junho Huh
Abstract: A mobile device includes; a PCB including a first side and a second side, a PMIC generating power supply voltages and mounted on the second side of the PCB, a package substrate mounted on the first side of PCB using first interconnects, an IC mounted on the first side of the package substrate, LDO regulators mounted on the second side of the package substrate and disposed between the first interconnects, and high density capacitors disposed between each of the LDO regulators and the second side of the package substrate, wherein the PCB includes first electrical paths connecting the PMIC to the LDO regulators, and the package substrate includes second electrical paths connecting the LDO regulators to the IC.
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公开(公告)号:USD800403S1
公开(公告)日:2017-10-17
申请号:US29548281
申请日:2015-12-11
Applicant: Samsung Electronics Co., Ltd.
Designer: Sanghun Yoon , Kyoungmin Lee , Cheolyeon Jo , Seokwoo Kim
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公开(公告)号:USD745757S1
公开(公告)日:2015-12-15
申请号:US29485518
申请日:2014-03-19
Applicant: Samsung Electronics Co., Ltd.
Designer: Jaewon Choi , Dongwon Cheon , Yuna Park , Kyoungmin Lee
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公开(公告)号:USD737008S1
公开(公告)日:2015-08-18
申请号:US29485517
申请日:2014-03-19
Applicant: Samsung Electronics Co., Ltd.
Designer: Dongwon Cheon , Kyoungmin Lee
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公开(公告)号:USD792668S1
公开(公告)日:2017-07-18
申请号:US29548264
申请日:2015-12-11
Applicant: Samsung Electronics Co., Ltd.
Designer: Sanghun Yoon , Kyoungmin Lee , Cheolyeon Jo , Seokwoo Kim
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公开(公告)号:USD792039S1
公开(公告)日:2017-07-11
申请号:US29548274
申请日:2015-12-11
Applicant: Samsung Electronics Co., Ltd.
Designer: Sanghun Yoon , Kyoungmin Lee , Cheolyeon Jo , Seokwoo Kim
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公开(公告)号:USD752300S1
公开(公告)日:2016-03-22
申请号:US29485485
申请日:2014-03-19
Applicant: Samsung Electronics Co., Ltd.
Designer: Dongwon Cheon , Kyoungmin Lee
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公开(公告)号:USD744178S1
公开(公告)日:2015-11-24
申请号:US29485521
申请日:2014-03-19
Applicant: Samsung Electronics Co., Ltd.
Designer: Jaewon Choi , Dongwon Cheon , Yuna Park , Kyoungmin Lee
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公开(公告)号:US20240353442A1
公开(公告)日:2024-10-24
申请号:US18643294
申请日:2024-04-23
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Moonil Kim , Kyoungmin Lee , Junnyeong Cho
CPC classification number: G01R1/045 , G01R1/0466 , G01R1/06722
Abstract: Provided are a probe card and a semiconductor device inspection system including the same. A probe card includes a socket structure including at least one socket, and a plane structure located on the socket structure. The at least one socket includes at least one RF signal pin through which a signal of a radio frequency (RF) band is transmitted, and at least one ground pin. The plane structure includes an RF plane including at least one RF signal line electrically connected to the at least one RF signal pin, and a ground plane electrically connected to the at least one ground pin, the ground plane being located between the RF plane and the socket structure.
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公开(公告)号:USD812827S1
公开(公告)日:2018-03-13
申请号:US29548272
申请日:2015-12-11
Applicant: Samsung Electronics Co., Ltd.
Designer: Sanghun Yoon , Kyoungmin Lee , Cheolyeon Jo , Seokwoo Kim
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