公开(公告)号：US11329014B2

公开(公告)日：2022-05-10

申请号：US16703279

申请日：2019-12-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Myungsam Kang ,  Changbae Lee ,  Bongju Cho ,  Younggwan Ko ,  Yongkoon Lee ,  Moonil Kim ,  Youngchan Ko

IPC: H01L23/66 ,  H01L23/31 ,  H01L23/498 ,  H01L23/00 ,  H01L23/522

Abstract: A semiconductor package includes: a connection structure including one or more redistribution layers; a core structure disposed on a surface of the connection structure; a semiconductor chip disposed on the surface and including connection pads electrically connected to the redistribution layers of the connection structure; a first encapsulant disposed on the surface and covering at least a portion of each of the core structure and the semiconductor chip; an antenna substrate disposed on the first encapsulant and including one or more wiring layers, at least a portion of the wiring layers including an antenna pattern; and a through via penetrating at least a portion of each of the connection structure, the core structure, the first encapsulant, and the antenna substrate.

公开(公告)号：US20220262748A1

公开(公告)日：2022-08-18

申请号：US17737472

申请日：2022-05-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Myungsam KANG ,  Changbae Lee ,  Bongju Cho ,  Younggwan Ko ,  Yongkoon Lee ,  Moonil Kim ,  Youngchan Ko

IPC: H01L23/66 ,  H01L23/31 ,  H01L23/498 ,  H01L23/00 ,  H01L23/522

Abstract: A semiconductor package includes: a connection structure having a first surface and a second, and including a redistribution layer; a passive component disposed on the first surface of the connection structure, and electrically connected to the redistribution layer; a semiconductor chip disposed on the first surface of the connection structure, and electrically connected to the redistribution layer; a first encapsulant disposed on the first surface of the connection structure and covering at least a portion of the semiconductor chip; a second encapsulant disposed on the first surface of the connection structure and covering at least a portion of the passive component; an antenna substrate disposed on the first encapsulant and including a wiring layer, at least a portion of the wiring layer including an antenna pattern; and a through via penetrating at least a portion of each of the connection structure, the first encapsulant, and the antenna substrate.

公开(公告)号：US11935847B2

公开(公告)日：2024-03-19

申请号：US17737472

申请日：2022-05-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Myungsam Kang ,  Changbae Lee ,  Bongju Cho ,  Younggwan Ko ,  Yongkoon Lee ,  Moonil Kim ,  Youngchan Ko

IPC: H01L23/66 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L23/522

CPC classification number: H01L23/66 ,  H01L23/3114 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/5226 ,  H01L24/05 ,  H01L24/13 ,  H01L2223/6677 ,  H01L2224/0401

Abstract: A semiconductor package includes: a connection structure having a first surface and a second, and including a redistribution layer; a passive component disposed on the first surface of the connection structure, and electrically connected to the redistribution layer; a semiconductor chip disposed on the first surface of the connection structure, and electrically connected to the redistribution layer; a first encapsulant disposed on the first surface of the connection structure and covering at least a portion of the semiconductor chip; a second encapsulant disposed on the first surface of the connection structure and covering at least a portion of the passive component; an antenna substrate disposed on the first encapsulant and including a wiring layer, at least a portion of the wiring layer including an antenna pattern; and a through via penetrating at least a portion of each of the connection structure, the first encapsulant, and the antenna substrate.

公开(公告)号：US20240353442A1

公开(公告)日：2024-10-24

申请号：US18643294

申请日：2024-04-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Moonil Kim ,  Kyoungmin Lee ,  Junnyeong Cho

IPC: G01R1/04 ,  G01R1/067

CPC classification number: G01R1/045 ,  G01R1/0466 ,  G01R1/06722

Abstract: Provided are a probe card and a semiconductor device inspection system including the same. A probe card includes a socket structure including at least one socket, and a plane structure located on the socket structure. The at least one socket includes at least one RF signal pin through which a signal of a radio frequency (RF) band is transmitted, and at least one ground pin. The plane structure includes an RF plane including at least one RF signal line electrically connected to the at least one RF signal pin, and a ground plane electrically connected to the at least one ground pin, the ground plane being located between the RF plane and the socket structure.

公开(公告)号：US10727565B2

公开(公告)日：2020-07-28

申请号：US15380326

申请日：2016-12-15

Applicant: Samsung Electronics Co., Ltd. ,  Korea University Research and Business Foundation

Inventor： Moonil Kim ,  Kyoung Min Lee ,  Seung Ho Choi

IPC: H01Q13/18 ,  H01Q5/342 ,  H01Q5/25 ,  H01Q1/38 ,  H01Q9/04 ,  H01Q1/22 ,  H01P7/06

Abstract: An apparatus of an antenna is provided. The apparatus includes a first conductor plate disposed on an upper side of a single plate and comprising an aperture, a plurality of vias inserted to vertically penetrate through the single plate, a second conductor plate disposed on a lower side of the single plate, and a feed line for applying a signal to radiate to a dielectric resonator embedded as a cavity which is formed by the first conductor plate, the second conductor plate, and the vias. The aperture is in a size which produces multiple-resonance at an operating frequency.