公开(公告)号：US20130068731A1

公开(公告)日：2013-03-21

申请号：US13656290

申请日：2012-10-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Minill KIM ,  Kwang Yong LEE ,  Jonggi LEE ,  Ji-Seok HONG

IPC: B23K1/00

CPC classification number: B23K1/00 ,  B23K1/0016 ,  B23K1/002 ,  B23K1/008 ,  B23K3/0475 ,  B23K3/087 ,  B23K2101/42 ,  H01L24/75 ,  H01L24/81 ,  H05K3/3494 ,  H05K2203/101 ,  H05K2203/1509

Abstract: A reflow method of a solder ball provided to a treatment object may include providing a coil, applying a current to the coil, and moving the treatment object through an internal space surrounded by the coil.

Abstract translation: 提供给处理物体的焊球的回流方法可以包括提供线圈，向线圈施加电流，以及通过由线圈包围的内部空间移动处理物体。