公开(公告)号：US20240274661A1

公开(公告)日：2024-08-15

申请号：US18507606

申请日：2023-11-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungyoung YOON ,  Jonghwa SHIN ,  Minyeul LEE ,  Sungyeol KIM ,  Taekjin KIM ,  Meehyun LIM ,  Sungyong LIM

IPC: H01L29/06

CPC classification number: H01L29/0657 ,  H01L29/0692

Abstract: A dielectric structure may include: an insulating layer extending in a first direction; a plurality of conductor layers disposed on a first surface of the insulating layer and spaced apart from each other in the first direction; at least one semiconductor layer disposed on a second surface of the insulating layer, opposite to the first surface, and overlapping each of at least two conductor layers adjacent to each other among the plurality of conductor layers in a second direction intersecting the first direction; a first protective layer covering the plurality of conductor layers on the first surface of the insulating layer; and a second protective layer covering the at least one semiconductor layer on the second surface of the insulating layer.