公开(公告)号：US20200066565A1

公开(公告)日：2020-02-27

申请号：US16432281

申请日：2019-06-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Myoung-soo Park ,  Siqing Lu ,  Michio Ishikawa ,  Masashi Kikuchi

IPC: H01L21/683 ,  H01L21/67

Abstract: An electrostatic chuck according to an embodiment includes a fixing plate on which a wafer is fixed, an electrostatic plate located under the fixing plate and configured to generate an electrostatic force to fix the wafer on the fixing plate, a plurality of heating elements located under the electrostatic plate and separated to locally control a temperature of the electrostatic plate, and a cooling plate located under the plurality of separated heating elements and configured to emit heat transferred by the plurality of separated heating elements.