公开(公告)号：US11728198B2

公开(公告)日：2023-08-15

申请号：US16432281

申请日：2019-06-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Myoung-Soo Park ,  Siqing Lu ,  Michio Ishikawa ,  Masashi Kikuchi

IPC: H01L21/283 ,  H01L21/67 ,  H01L21/683

CPC classification number: H01L21/6833 ,  H01L21/67063 ,  H01L21/67103

Abstract: An electrostatic chuck according to an embodiment includes a fixing plate on which a wafer is fixed, an electrostatic plate located under the fixing plate and configured to generate an electrostatic force to fix the wafer on the fixing plate, a plurality of heating elements located under the electrostatic plate and separated to locally control a temperature of the electrostatic plate, and a cooling plate located under the plurality of separated heating elements and configured to emit heat transferred by the plurality of separated heating elements.

公开(公告)号：US20200066565A1

公开(公告)日：2020-02-27

申请号：US16432281

申请日：2019-06-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Myoung-soo Park ,  Siqing Lu ,  Michio Ishikawa ,  Masashi Kikuchi

IPC: H01L21/683 ,  H01L21/67

Abstract: An electrostatic chuck according to an embodiment includes a fixing plate on which a wafer is fixed, an electrostatic plate located under the fixing plate and configured to generate an electrostatic force to fix the wafer on the fixing plate, a plurality of heating elements located under the electrostatic plate and separated to locally control a temperature of the electrostatic plate, and a cooling plate located under the plurality of separated heating elements and configured to emit heat transferred by the plurality of separated heating elements.

公开(公告)号：US11309203B2

公开(公告)日：2022-04-19

申请号：US16458264

申请日：2019-07-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kazuyuki Tomizawa ,  Masashi Kikuchi ,  Michio Ishikawa ,  Takafumi Noguchi ,  Kazuhiro Yamamuro

IPC: H01T23/00 ,  H01L21/683 ,  F25B21/02 ,  H01L21/67 ,  H01L35/30

Abstract: A wafer stage includes an electrostatic chuck (ESC) plate, an upper supporting plate, a lower supporting plate and a temperature controller. The ESC plate includes a first surface that supports a wafer. The upper supporting plate is bonded to a second surface of the ESC plate opposite to the first surface. The lower supporting plate overlaps the upper supporting plate. The temperature controller is disposed between the upper supporting plate and the lower supporting plate. The ESC plate includes ceramics. The upper supporting plate includes a composite material of aluminum or aluminum alloy and ceramics or carbon. The ESC plate and the upper supporting plate are directly bonded to each other by a room temperature solid bonding process. Thus, the wafer stage has sufficient strength to withstand pressure differences between a vacuum and atmospheric pressure, improved temperature response by minimizing heat capacity, and prevents warpage of the ESC plate.

公开(公告)号：US10718053B2

公开(公告)日：2020-07-21

申请号：US15846785

申请日：2017-12-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kazuyuki Tomizawa ,  Masashi Kikuchi ,  Michio Ishikawa ,  Naoki Takahashi

IPC: C23C16/46 ,  H01L21/687 ,  H01L21/67 ,  H01L21/683

Abstract: A wafer loading apparatus capable of making a temperature distribution in a surface of a wafer more uniform is provided. The wafer loading apparatus includes a stage on which a wafer is loaded, and a heater installed in the stage to heat a wafer loaded on a loading surface of the stage. The stage includes a top plate providing the loading surface. The heater includes first heater coils disposed on a surface of the top plate opposite to the loading surface, electrode portions electrically connected to the first heater coils and arranged side by side along an outer peripheral portion of the top plate, and a second heater coil disposed outside the first heater coils. The second heater coil generates heat in such a way that a heat distribution in a circumferential direction is varied corresponding to the arrangement of the electrode portions.