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公开(公告)号：US20240170429A1
公开(公告)日：2024-05-23
申请号：US18346371
申请日：2023-07-03
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Sangho Cha , Yunrae Cho
IPC: H01L23/00 , H01L23/498 , H01L25/065
CPC classification number: H01L24/09 , H01L23/49822 , H01L24/05 , H01L24/08 , H01L24/16 , H01L25/0657 , H01L2224/05647 , H01L2224/05655 , H01L2224/08052 , H01L2224/0903 , H01L2224/16148 , H01L2225/06513 , H01L2924/3511
Abstract: A semiconductor chip includes a semiconductor substrate that includes an upper surface and a lower surface opposite to the upper surface, a center pad disposed on a center portion of the upper surface and an edge portion disposes on an outer portion of the upper surface; a wiring structure that includes a wiring insulating layer disposed on a lower surface of the semiconductor substrate and a wiring pattern disposed in the wiring insulating layer and electrically connected to the semiconductor substrate; a first bump pad disposed on a first surface of the wiring structure and electrically connected to the wiring pattern; and a first connection bump that connects the first bump pad to an external device. The center pad has a regular octagon shape, and the edge pad has an extended octagon shape formed by extending squares from four non-continuous sides of a regular octagon.
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2.发明授权Polylactic acid preparation method, polylactic acid resin prepared using the method, resin composition comprising the polylactic acid resin, and catalyst system for preparing polylactic acid 有权聚乳酸制备方法，使用该方法制备的聚乳酸树脂，包含聚乳酸树脂的树脂组合物和用于制备聚乳酸的催化剂体系公开(公告)号：US09234075B2
公开(公告)日：2016-01-12
申请号：US14507514
申请日：2014-10-06
Applicant: Samsung Electronics Co., Ltd. , SNU R&DB Foundation
Inventor： Younghoon Lee , Chansu Kim , Hail Kwon , Changduk Kang , Jongchan Lee , Kwangmyung Cho , Sangho Cha , Hyunkee Hong
CPC classification number: C08G63/823
Abstract: A method of preparing polylactic acid by combining lactide with a main catalyst and cocatalyst, wherein the main catalyst includes an organometallic compound and a cocatalyst includes a nanoparticle; as well as a composition are provided.
Abstract translation: 通过将丙交酯与主催化剂和助催化剂组合制备聚乳酸的方法，其中主催化剂包括有机金属化合物和助催化剂，包括纳米颗粒; 以及组合物。
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公开(公告)号：US20250132275A1
公开(公告)日：2025-04-24
申请号：US18909082
申请日：2024-10-08
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sangho Cha , Yunrae Cho
IPC: H01L23/00 , H01L25/065 , H10B80/00
Abstract: A semiconductor package includes a semiconductor substrate, connection pads on a bottom surface of the semiconductor substrate, and connection bumps respectively on the connection pads, wherein the connection bumps include an extension bump and a non-extension bump, wherein the extension bump includes an extension seed layer on a respective one of the connection pads and a first conductive pillar on the extension seed layer, and wherein the extension seed layer longitudinally extends in a first extension direction.
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4.发明申请POLYLACTIC ACID PREPARATION METHOD, POLYLACTIC ACID RESIN PREPARED USING THE METHOD, RESIN COMPOSITION COMPRISING THE POLYLACTIC ACID RESIN, AND CATALYST SYSTEM FOR PREPARING POLYLACTIC ACID 有权聚酸制备方法，使用该方法制备的聚酯酸树脂，包含聚酸树脂的树脂组合物和用于制备聚酸的催化剂体系公开(公告)号：US20150225501A1
公开(公告)日：2015-08-13
申请号：US14507514
申请日：2014-10-06
Applicant: Samsung Electronics Co., Ltd. , SNU R&DB Foundation
Inventor： Younghoon Lee , Chansu Kim , Hail Kwon , Changduk Kang , Jongchan Lee , Kwangmyung Cho , Sangho Cha , Hyunkee Hong
IPC: C08G63/82
CPC classification number: C08G63/823
Abstract: A method of preparing polylactic acid by combining lactide with a main catalyst and cocatalyst, wherein the main catalyst includes an organometallic compound and a cocatalyst includes a nanoparticle; as well as a composition are provided.
Abstract translation: 通过将丙交酯与主催化剂和助催化剂组合制备聚乳酸的方法，其中主催化剂包括有机金属化合物和助催化剂，包括纳米颗粒; 以及组合物。
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