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公开(公告)号:US11818781B2
公开(公告)日:2023-11-14
申请号:US17335577
申请日:2021-06-01
Applicant: Samsung Electronics Co., Ltd.
Inventor: Juyeon Jin , Gupil Cheong , Sanghyeok Sim , Doosuk Kang , Bokun Choi
CPC classification number: H04W76/15 , H04R1/40 , H04W12/55 , H04W72/0446 , H04W76/14 , H04R2420/07
Abstract: An electronic device is provided. The electronic device includes an audio reception circuit, an audio output circuit, a communication circuit configured to support Bluetooth communication, a processor, and a memory. The processor may be configured to connect to a first external electronic device by a first communication link, connect a second external electronic device with a second communication link, transmit connection information including information about the first communication link to the second external electronic device via the second communication link, receive first data from the second external electronic device via the first communication link on a first time slot for data transmission from the first external electronic device of the first communication link, and transmit second data to the second external electronic device via the first communication link on a second time slot for data transmission to the first external electronic device of the first communication link.
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2.
公开(公告)号:US20210092578A1
公开(公告)日:2021-03-25
申请号:US16992748
申请日:2020-08-13
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kyusang Ryu , Gupil Cheong , Sanghyeok Sim , Sungjun Choi , Doosuk Kang , Seongmin Je
Abstract: An audio electronic device includes a communication circuit; and a processor operatively connected to the communication circuit, wherein the processor is configured to establish a first communication link with an external audio electronic device through the communication circuit, receive data from a first external electronic device by monitoring a second communication link established between the external audio electronic device and the first external electronic device, and when a right for a third communication link established between the external audio electronic device and a second external electronic device is given from the external audio electronic device, manage and maintain the third communication link, and transmit and receive data to and from the second external electronic device.
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3.
公开(公告)号:US11818636B2
公开(公告)日:2023-11-14
申请号:US16992748
申请日:2020-08-13
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kyusang Ryu , Gupil Cheong , Sanghyeok Sim , Sungjun Choi , Doosuk Kang , Seongmin Je
CPC classification number: H04W4/80 , G06F3/165 , H04R3/12 , H04W76/14 , H04R2227/005 , H04R2420/07
Abstract: An audio electronic device includes a communication circuit; and a processor operatively connected to the communication circuit, wherein the processor is configured to establish a first communication link with an external audio electronic device through the communication circuit, receive data from a first external electronic device by monitoring a second communication link established between the external audio electronic device and the first external electronic device, and when a right for a third communication link established between the external audio electronic device and a second external electronic device is given from the external audio electronic device, manage and maintain the third communication link, and transmit and receive data to and from the second external electronic device.
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公开(公告)号:US11720317B2
公开(公告)日:2023-08-08
申请号:US17171165
申请日:2021-02-09
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kyusang Ryu , Gupil Cheong , Sanghyeok Sim , Sungjun Choi , Doosuk Kang , Seongmin Je
CPC classification number: G06F3/162 , G10L19/00 , H04B3/54 , H04R1/08 , H04R1/1016 , H04R1/1025 , H04R1/1041 , H04W4/80 , H04W76/14 , H04R2420/07
Abstract: According to certain embodiments, an electronic device comprises a communication circuit, a memory including a buffer configured to store audio data received from an external electronic device via the communication circuit, an audio output circuit, and a processor electrically connected to the communication circuit, the memory, and the audio output circuit.
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