公开(公告)号：US20230005835A1

公开(公告)日：2023-01-05

申请号：US17851129

申请日：2022-06-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyeonjun SONG ,  Taehyeong KIM ,  Sangyoung KIM

IPC: H01L23/498 ,  H01L25/065 ,  H01L23/31 ,  H01L23/29 ,  H01L23/00

Abstract: A semiconductor package includes a base chip including a passivation layer on an upper surface thereof, a semiconductor chip on the base chip, a bump on a lower surface of the semiconductor chip, an underfill layer covering the bump and covering the lower surface of the semiconductor chip, an encapsulant covering the semiconductor chip on the base chip, and an organic material layer on the passivation layer, wherein the base chip includes silicon (Si), the passivation layer has a first region in contact with the underfill layer and a second region, surrounding the first region, and the organic material layer is on the second region.