公开(公告)号：US20190114755A1

公开(公告)日：2019-04-18

申请号：US15937551

申请日：2018-03-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seong Sil LEE ,  Sung Yoon RYU ,  Young Hoon SOHN ,  Chung Sam JUN

IPC: G06T7/00 ,  G01J5/02 ,  G01N25/72 ,  H04N5/33

Abstract: According to one embodiment, a semiconductor chip inspection device includes a conveyor, an image capture device, and an analysis system. The conveyor provides a transfer path on which a semiconductor chip heated during a manufacturing process is moved. The image capture device is disposed above the transfer path and is configured to generate a thermographic image by imaging the semiconductor chip including capturing a plurality of thermographic images at different focal points in a thickness direction of the semiconductor chip. The analysis system is configured to compare the plurality of thermographic images with a plurality of standard images provided in advance, and to detect a region in which a temperature differential between a thermographic image and a respective standard image exceeds a reference value.