公开(公告)号：US11324450B2

公开(公告)日：2022-05-10

申请号：US16684537

申请日：2019-11-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Daniel Joe ,  Minhyun Cho ,  Seyong Lee

IPC: A61B5/00 ,  H04W4/38 ,  H04B1/3827 ,  A61B5/024 ,  H04W84/18

Abstract: An electronic device may include: a housing; a display configured to be viewed through a first portion of the housing; a photoplethysmogram sensor exposed through a second portion of the housing and configured to measure a biometric signal from a body part of a user while being in contact with the body part of the user; a fastening structure connected to the housing and configured to be attached to the body part of the user; a wireless communication circuit; a processor provided inside the housing and operatively connected to the display, the photoplethysmogram sensor, and the wireless communication circuit; and a memory operatively connected to the processor. The memory stores instructions, when executed, to allow the processor to: receive data from the photoplethysmogram sensor; determine a first parameter; determine a distance between the body part of the user and the fastening structure; and provide user guidance information on the display.

公开(公告)号：US20230130983A1

公开(公告)日：2023-04-27

申请号：US17878355

申请日：2022-08-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seyong Lee ,  Jungseok Ahn ,  Kuyoung Kim

IPC: H01L23/31 ,  H01L25/065 ,  H01L23/00 ,  H01L21/56

Abstract: A semiconductor device includes: a plurality of semiconductor chips stacked on a substrate in a vertical direction; a filler structure including a plurality of horizontal underfill layers formed between adjacent semiconductor chips of the plurality of semiconductor chips and between the substrate and the stack of semiconductor chips, and including underfill sidewalls formed around the horizontal underfill layers and the plurality of semiconductor chips; and a molding resin surrounding the plurality of semiconductor chips at least on side surfaces of the plurality of semiconductor chips. The underfill sidewalls include a recess pattern, which is disposed on and along the side surfaces of at least one of the plurality of semiconductor chips, and is recessed in a direction parallel to an upper surface of the substrate at locations where the recess pattern meets the substrate.

公开(公告)号：US20210074660A1

公开(公告)日：2021-03-11

申请号：US16864783

申请日：2020-05-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seyong Lee

IPC: H01L23/00 ,  H01L23/31 ,  H01L25/065

Abstract: A semiconductor package includes a first semiconductor chip including a first through electrode. A second semiconductor chip is stacked on the first semiconductor chip. The second semiconductor chip includes a second through electrode. A plurality of conductive bumps are interposed between the first semiconductor chip and the second semiconductor chip. The conductive bumps electrically connect the first and second through electrodes to each other. A filling support layer at least partially covers a first surface of the second semiconductor chip facing the first semiconductor chip and at least partially fills spaces between the conductive bumps. An adhesive layer is disposed on the filling support layer at least partially filling the spaces between the conductive bumps and adhering the first and second semiconductor chips to each other.