公开(公告)号：US20230130983A1

公开(公告)日：2023-04-27

申请号：US17878355

申请日：2022-08-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seyong Lee ,  Jungseok Ahn ,  Kuyoung Kim

IPC: H01L23/31 ,  H01L25/065 ,  H01L23/00 ,  H01L21/56

Abstract: A semiconductor device includes: a plurality of semiconductor chips stacked on a substrate in a vertical direction; a filler structure including a plurality of horizontal underfill layers formed between adjacent semiconductor chips of the plurality of semiconductor chips and between the substrate and the stack of semiconductor chips, and including underfill sidewalls formed around the horizontal underfill layers and the plurality of semiconductor chips; and a molding resin surrounding the plurality of semiconductor chips at least on side surfaces of the plurality of semiconductor chips. The underfill sidewalls include a recess pattern, which is disposed on and along the side surfaces of at least one of the plurality of semiconductor chips, and is recessed in a direction parallel to an upper surface of the substrate at locations where the recess pattern meets the substrate.

公开(公告)号：US20250079250A1

公开(公告)日：2025-03-06

申请号：US18810742

申请日：2024-08-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yeongkwon Ko ,  Unbyoung Kang ,  Soyeon Kwon ,  Kuyoung Kim

IPC: H01L23/31 ,  H01L23/00 ,  H01L23/48 ,  H01L25/18 ,  H10B80/00

Abstract: A semiconductor package includes a substrate structure, a plurality of semiconductor chips sequentially stacked on the substrate structure, a molding member on the substrate structure and surrounding side surfaces of the plurality of semiconductor chips, the molding member including a first material, and a first reforming portion in a side portion of the molding member, and extending horizontally in the side portion of the molding member to have a predetermined width from an outer side surface of the molding member. The first reforming portion may include a second material that is more brittle than the first material.

公开(公告)号：US20230075665A1

公开(公告)日：2023-03-09

申请号：US17875983

申请日：2022-07-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Wonkyun Kwon ,  Jungseok Ahn ,  Kuyoung Kim

IPC: H01L23/31 ,  H01L25/065 ,  H01L23/00 ,  H01L21/56

Abstract: A semiconductor package includes a substrate, a plurality of semiconductor devices stacked on the substrate, an under-fill fillet on side surfaces of the plurality of semiconductor devices, and a molding resin surrounding the plurality of semiconductor devices. An uppermost end of the under-fill fillet includes a planar surface coplanar with an upper surface of a periphery of an uppermost semiconductor device among the plurality of semiconductor devices, and the molding resin completely covers the planar surface.