公开(公告)号：US20240243153A1

公开(公告)日：2024-07-18

申请号：US18405372

申请日：2024-01-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Minjun CHOI ,  Jihyun KWAK ,  Hyoeun KIM ,  Surim LEE

IPC: H01L27/146 ,  H01L23/00 ,  H01L23/522

CPC classification number: H01L27/14634 ,  H01L23/5223 ,  H01L24/08 ,  H01L24/80 ,  H01L27/14636 ,  H01L27/1469 ,  H01L2224/08145 ,  H01L2224/80895 ,  H01L2224/80896

Abstract: An image sensor is provided. The image sensor includes a first semiconductor chip including a first semiconductor substrate having a pixel unit, a first wiring structure having a first wiring layer, and a first bonding pad; a second semiconductor chip including a second semiconductor substrate having first and second surfaces, a second wiring structure on the first surface, contacting the first wiring structure, and having a second wiring layer, a second upper bonding pad bonded to the first bonding pad, and a via structure connected to the second wiring layer and extending to the second surface; a bonding layer including a bonding insulating layer on the second surface, and a second lower bonding pad connected to the via structure; and a third semiconductor chip including a third semiconductor substrate, a third wiring structure contacting the bonding insulating layer, and a third bonding pad bonded to the second lower bonding pad.