公开(公告)号：US20200373186A1

公开(公告)日：2020-11-26

申请号：US16703062

申请日：2019-12-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hoe Chul Kim ,  Seok Ho Kim ,  Tae Yeong Kim ,  Hoon Joo Na ,  Hyung Jun Jeon

IPC: H01L21/683 ,  H01L21/677 ,  H01L23/00

Abstract: A wafer bonding apparatus is provided includes a lower support plate configured to structurally support a first wafer on an upper surface of the lower support plate; a lower structure adjacent to the lower support plate and movable in a vertical direction that is perpendicular to the upper surface of the lower support plate, an upper support plate configured to structurally support a second wafer on a lower surface of the lower support plate, and an upper structure adjacent to the upper support plate and movable in the vertical direction.

公开(公告)号：US10468400B2

公开(公告)日：2019-11-05

申请号：US15869808

申请日：2018-01-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Pil Kyu Kang ,  Seok Ho Kim ,  Tae Yeong Kim ,  Kwang Jin Moon ,  Ho Jin Lee

IPC: H01L25/00 ,  H01L25/065 ,  H01L21/768 ,  H01L21/18 ,  H01L23/00

Abstract: A method of manufacturing a substrate structure includes providing a first substrate including a first device region on a first surface, providing a second substrate including a second device region on a second surface, such that a width of the first device region is greater than a width of the second device region, and bonding the first substrate and the second substrate, such that the first and second device regions are facing each other and are electrically connected to each other.

公开(公告)号：US11728200B2

公开(公告)日：2023-08-15

申请号：US16703062

申请日：2019-12-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hoe Chul Kim ,  Seok Ho Kim ,  Tae Yeong Kim ,  Hoon Joo Na ,  Hyung Jun Jeon

IPC: H01L21/683 ,  H01L23/00 ,  H01L21/677

CPC classification number: H01L21/6836 ,  H01L21/67757 ,  H01L24/94

Abstract: A wafer bonding apparatus is provided includes a lower support plate configured to structurally support a first wafer on an upper surface of the lower support plate; a lower structure adjacent to the lower support plate and movable in a vertical direction that is perpendicular to the upper surface of the lower support plate, an upper support plate configured to structurally support a second wafer on a lower surface of the lower support plate, and an upper structure adjacent to the upper support plate and movable in the vertical direction.

公开(公告)号：US10833047B2

公开(公告)日：2020-11-10

申请号：US16354359

申请日：2019-03-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hoe Chul Kim ,  Dong Eog Kim ,  Tae Yeong Kim

IPC: H01L23/00

Abstract: A substrate bonding apparatus includes a lower chuck, an upper chuck, an electric actuator on a central portion of the upper chuck, a pressure sensor, and a controller. The lower chuck may support a lower substrate, the upper chuck may face the lower chuck such that a lower surface of the upper chuck faces the upper surface of the lower chuck, and the upper chuck may support an upper substrate. The electric actuator may lower a bonding pin through the upper chuck to apply a pressure to the upper substrate supported on the upper chuck. The pressure sensor may be below the lower substrate supported on the lower chuck. The pressure sensor may sense a lowering pressure applied by the bonding pin to the pressure sensor in real time. The controller may control the lowering pressure applied by the bonding pin.