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    SYSTEM FOR DESIGNING INTEGRATED CIRCUIT USING EXTRACTED MODEL PARAMETER AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT USING THE SAME
    1.
    发明申请
    SYSTEM FOR DESIGNING INTEGRATED CIRCUIT USING EXTRACTED MODEL PARAMETER AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT USING THE SAME 审中-公开

    公开(公告)号：US20200004911A1

    公开(公告)日：2020-01-02

    申请号：US16439115

    申请日：2019-06-12

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Yo-han Kim

    IPC: G06F17/50

    Abstract: A method of manufacturing an integrated circuit in which a semiconductor device is provided includes simulating electrical characteristics of the semiconductor device according to a received process variable, by using a model parameter file including a plurality of model parameters, generating semiconductor device layout data based on a result of the simulation, and manufacturing the integrated circuit according to a semiconductor device layout based on the semiconductor device layout data, wherein the plurality of model parameters are stored in the model parameter file in a form of at least one function regarding the process variable.

    Method and system for controlling device
    4.
    发明授权
    Method and system for controlling device 有权

    公开(公告)号：US11513676B2

    公开(公告)日：2022-11-29

    申请号：US17038862

    申请日：2020-09-30

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Yu-sung Joo ,  Yo-han Kim ,  Eun-kyo Baek ,  Jong-won Lee ,  Hyun-kwon Chung

    IPC: G06F3/0488

    Abstract: A method of controlling a device includes determining a distance between the device and a hovering inputter; determining 3-dimensional (3D) location information of a hovering input based on the distance; selecting a task among a plurality of tasks corresponding to an operation of an application executed by the device and the 3D location information of the hovering input; determining a class of an execution input according to the hovering input; and performing the selected task according to the determined class of the execution input.

    Method and system for controlling device
    6.
    发明授权
    Method and system for controlling device 有权

    公开(公告)号：US10824323B2

    公开(公告)日：2020-11-03

    申请号：US14955663

    申请日：2015-12-01

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Yu-sung Joo ,  Yo-han Kim ,  Eun-kyo Baek ,  Jong-won Lee ,  Hyun-kwon Chung

    IPC: G06F3/041 ,  G06F3/0488

    Abstract: A method of controlling a device includes determining a distance between the device and a hovering inputter; determining 3-dimensional (3D) location information of a hovering input based on the distance; selecting a task among a plurality of tasks corresponding to an operation of an application executed by the device and the 3D location information of the hovering input; determining a class of an execution input according to the hovering input; and performing the selected task according to the determined class of the execution input.

    Methods and systems for manufacturing image sensors
    9.
    发明授权
    Methods and systems for manufacturing image sensors 有权

    公开(公告)号：US10529779B2

    公开(公告)日：2020-01-07

    申请号：US15869466

    申请日：2018-01-12

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Yo-han Kim ,  Jong-wook Jeon ,  Ui-hui Kwon

    IPC: G06F17/50 ,  H01L27/30 ,  H01L27/146 ,  H01L33/08 ,  H01L27/12

    Abstract: A method of manufacturing an image sensor that includes first and second semiconductor chips includes receiving manufacturing data respectively associated with the first and second semiconductor chips, processing the manufacturing data to determine a capacitance and a resistance of a pixel signal transmission line to which a pixel signal generated by each pixel of the plurality of pixels is transmitted, where the capacitance and the resistance corresponding to position information associated with each pixel of the plurality of pixels, and determining predicted characteristics of the image sensor based on the determined capacitance and resistance, prior to the first semiconductor chip being electrically connected to the second semiconductor chip. The first semiconductor chip may be electrically connected to the second semiconductor chip to form the image sensor based on a determination that the predicted characteristics of the image sensor at least meet a particular set of one or more target values.

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