公开(公告)号：US11205604B2

公开(公告)日：2021-12-21

申请号：US16148471

申请日：2018-10-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jae Choon Kim ,  Woo Hyun Park ,  Eon Soo Jang ,  Young Sang Cho

IPC: H01L23/36 ,  H01L23/367 ,  H01L23/31 ,  H01L23/538 ,  H01L23/00 ,  H01L21/48 ,  H01L21/683 ,  H01L23/13 ,  H01L25/10 ,  H01L23/498

Abstract: A semiconductor package includes a semiconductor chip having a first surface that is an active surface and a second surface opposing the first surface, a first redistribution portion disposed on the first surface, the first redistribution portion including a lower wiring layer electrically connected to the semiconductor chip, a thermal conductive layer disposed on the second surface of the semiconductor chip, a sealing layer surrounding a side surface of the semiconductor chip and a side surface of the thermal conductive layer, and a second redistribution portion disposed on the sealing layer, the second redistribution portion including a first upper wiring layer connected to the thermal conductive layer, the second redistribution portion including a second upper wiring layer electrically connected to the semiconductor chip.