公开(公告)号：US20250045149A1

公开(公告)日：2025-02-06

申请号：US18617082

申请日：2024-03-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jong Heon JEONG ,  Kangrak KWON ,  Youngkyu PARK ,  Hyunseok SEO ,  Kyungmin LEE ,  Dongwook LEE

IPC: G06F11/07

Abstract: An apparatus includes a port that is connected to a link including plural lanes to support communication between the apparatus and another device and that transmits a flit in a flit mode, and a processor that controls the link based on a link training and status state machine (LTSSM). The processor transitions from an L0 state to an L0p state, included in the LTSSM, for a portion of the plural lanes based on a receiver error occurring in the portion of the plural lanes and based on the link reaching a specific data rate using equalization bypass, and the port, after transitioning to the L0p state, transmits an ordered set (OS) through the portion of the plural lanes and transmits the flit through remaining lanes of the plural lanes.

公开(公告)号：US20230207356A1

公开(公告)日：2023-06-29

申请号：US17980723

申请日：2022-11-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seungbeom PARK ,  Seunghwa HYUN ,  Kijoo HONG ,  Taejoong KIM ,  Youngkyu PARK

IPC: H01L21/67 ,  H04N5/247 ,  G06T7/00 ,  G06T7/70 ,  H04N5/225 ,  G03F7/20

CPC classification number: H01L21/67259 ,  G03F7/7065 ,  G06T7/0004 ,  G06T7/70 ,  H01L21/67288 ,  H04N5/247 ,  H04N5/2256 ,  G06T2207/10056 ,  G06T2207/30148

Abstract: A wafer processing apparatus includes an X-θ stage unit having a rotary chuck capable of moving in an X direction and rotating in a θ direction, wherein a wafer is mounted on the rotary chuck and the wafer includes an edge portion adjacent to an edge of the wafer. In addition, the wafer processing apparatus includes: an edge bead removal (EBR) measurement and eccentricity measurement unit which is capable of inspecting a bead removal state of the edge portion of the wafer, and measuring eccentricity between the center of the rotary chuck and the center of the wafer; and an edge exposure of wafer (EEW) process unit which exposes the edge portion of the wafer after correcting the eccentricity between the center of the rotary chuck and the center of the wafer measured by the EBR measurement and eccentricity measurement unit.

公开(公告)号：US20220240170A1

公开(公告)日：2022-07-28

申请号：US17722173

申请日：2022-04-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngkyu PARK ,  Gwangho LEE ,  Changhun LEE ,  Daejun KANG ,  Inshik KANG ,  Janggun BAE ,  Dongsuk JUNG

IPC: H04W48/16 ,  H04W48/18 ,  H04W76/16 ,  H04W60/00

Abstract: Various embodiments of the present disclosure relate to a device and method for controlling a communication function in an electronic device. An electronic device comprises: a wireless communication circuit for supporting first communication and second communication; memory; and at least one processor, the at least one processor configured to: check identification information about a network when connected to the network through the first communication, determine whether the network supports the second communication, on the basis of the identification information about the network and network information related to the second communication, set, on the basis of whether the network supports the second communication, whether a function, related to the second communication, of the electronic device is activated; and transmit, to the network information related to whether the function, related to the second communication, of the electronic device is activated.