公开(公告)号：US20180209750A1

公开(公告)日：2018-07-26

申请号：US15686574

申请日：2017-08-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yun-hyeok IM ,  Myung-kyoon YIM ,  Kyoung-min LEE ,  Kyung-soo LEE

IPC: F28F27/00 ,  G05B15/02 ,  G06F1/20

CPC classification number: F28F27/00 ,  F28F2013/008 ,  F28F2200/00 ,  F28F2250/04 ,  G05B15/02 ,  G06F1/206 ,  G06F1/324 ,  G06F1/3296

Abstract: A controller configured to: acquire a temperature of a first component and a temperature of a second component; and adjust a thermal resistance of a medium between the first component and the second component based on the acquired temperature of the first component, the acquired temperature of the second component, a first temperature limit of the first component, and a second temperature limit of the second component.

公开(公告)号：US20130259092A1

公开(公告)日：2013-10-03

申请号：US13776973

申请日：2013-02-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yun-hyeok IM ,  Kyol Park ,  Tae-je Cho

IPC: G01K7/34 ,  G01K7/16

CPC classification number: G01K7/34 ,  G01K7/16 ,  G01K7/42

Abstract: A method of predicting a temperature includes operatively coupling a temperature prediction circuit to a device including a semiconductor chip, determining a correlation between a current and voltage of the temperature prediction circuit, and predicting a temperature with respect to power applied to the device using the determined correlation.

Abstract translation: 预测温度的方法包括将温度预测电路可操作地耦合到包括半导体芯片的装置，确定温度预测电路的电流和电压之间的相关性，以及使用所确定的温度预测相对于施加到装置的功率的温度 相关性。