公开(公告)号：US20140059852A1

公开(公告)日：2014-03-06

申请号：US14071241

申请日：2013-11-04

Applicant: Samsung electronics Co., Ltd.

Inventor： Soo-Jeoung PARK ,  Chul-Woo KIM ,  Kyoung-Sei CHOI ,  Kwang-Jin BAE

IPC: H05K3/46

CPC classification number: H05K3/46 ,  H05K3/4602 ,  H05K3/462 ,  H05K2201/096 ,  Y10T29/49155

Abstract: A multi-layer printed circuit board (PCB) and a method for fabricating the same are provided. The multi-layer printed circuit board may include a first film and a first insulation layer. The first film may include a first via therein and the first film may further include a first conductive pattern on an upper surface thereof and the first conductive layer may be electrically connected to the first via. The first insulation layer may be on the upper surface of the first film and the first insulation layer may include a second via therein and a second conductive pattern on an upper surface thereof and the second conductive pattern may be electrically connected to the second via. The second via may be electrically connected to the first conductive pattern.

Abstract translation: 提供了一种多层印刷电路板（PCB）及其制造方法。 多层印刷电路板可以包括第一膜和第一绝缘层。 第一膜可以包括其中的第一通孔，并且第一膜还可以包括在其上表面上的第一导电图案，并且第一导电层可以电连接到第一通孔。 第一绝缘层可以在第一膜的上表面上，并且第一绝缘层可以包括其中的第二通孔和在其上表面上的第二导电图案，并且第二导电图案可以电连接到第二通孔。 第二通孔可以电连接到第一导电图案。