公开(公告)号：US20240088863A1

公开(公告)日：2024-03-14

申请号：US18515882

申请日：2023-11-21

申请人： Murata Manufacturing Co., Ltd.

发明人： Munehisa WATANABE ,  Hideki IWAMOTO ,  Hajime KANDO ,  Syunsuke KIDO

IPC分类号： H03H9/02 ,  H03H3/02 ,  H03H3/04 ,  H03H3/08 ,  H03H3/10 ,  H03H9/54 ,  H10N30/01 ,  H10N30/80 ,  H10N30/85 ,  H10N30/87

CPC分类号： H03H9/0222 ,  H03H3/02 ,  H03H3/04 ,  H03H3/08 ,  H03H3/10 ,  H03H9/02574 ,  H03H9/02834 ,  H03H9/54 ,  H10N30/01 ,  H10N30/80 ,  H10N30/85 ,  H10N30/87 ,  H10N30/877 ,  H03H2003/023 ,  H03H2003/027 ,  Y10T29/42 ,  Y10T29/49005 ,  Y10T29/49155

摘要： An elastic wave device includes a supporting substrate, a high-acoustic-velocity film stacked on the supporting substrate and in which an acoustic velocity of a bulk wave propagating therein is higher than an acoustic velocity of an elastic wave propagating in a piezoelectric film, a low-acoustic-velocity film stacked on the high-acoustic-velocity film and in which an acoustic velocity of a bulk wave propagating therein is lower than an acoustic velocity of a bulk wave propagating in the piezoelectric film, the piezoelectric film is stacked on the low-acoustic-velocity film, and an IDT electrode stacked on a surface of the piezoelectric film.

公开(公告)号：US11919036B1

公开(公告)日：2024-03-05

申请号：US18232090

申请日：2023-08-09

申请人： Yield Engineering Systems, Inc.

发明人： Kenneth Sautter

IPC分类号： B05D1/00 ,  B05D3/10 ,  H05K3/38

CPC分类号： B05D1/60 ,  B05D3/102 ,  H05K3/386 ,  H05K3/389 ,  B05D2202/45 ,  B05D2518/00 ,  Y10T29/49155

摘要： A method of improving the adhesion of a metal-organic interface in an electronic device includes providing a substrate with a metal structure, treating a surface of the metal structure to form a monolayer coating of a selected chemical composition on the surface, and coating the treated surface with an organic material.

公开(公告)号：US11916400B2

公开(公告)日：2024-02-27

申请号：US17966542

申请日：2022-10-14

申请人： NuCurrent, Inc.

发明人： Vinit Singh ,  Christine A. Frysz

IPC分类号： H01Q7/00 ,  H02J50/00 ,  H02J50/12 ,  A61N1/05 ,  A61N1/372 ,  A61N1/378 ,  H01F5/00 ,  H01F7/06 ,  H01F17/00 ,  H01F27/28 ,  H01F29/02 ,  H01F38/14 ,  H01F41/00 ,  H01F41/04 ,  H01Q1/38 ,  H01R43/00 ,  H02P13/00 ,  H03H7/01 ,  H04B5/00 ,  H05B6/06 ,  H05B6/12 ,  H05B6/36 ,  B33Y80/00 ,  A61N1/36 ,  A61N1/375 ,  H05K1/16

CPC分类号： H02J50/005 ,  A61N1/0553 ,  A61N1/3787 ,  A61N1/37229 ,  H01F5/00 ,  H01F5/003 ,  H01F7/06 ,  H01F17/00 ,  H01F17/0006 ,  H01F27/2804 ,  H01F29/02 ,  H01F38/14 ,  H01F41/00 ,  H01F41/04 ,  H01F41/041 ,  H01Q1/38 ,  H01Q7/00 ,  H01R43/00 ,  H02J50/12 ,  H02P13/00 ,  H03H7/01 ,  H04B5/0037 ,  H04B5/0062 ,  H04B5/0068 ,  H04B5/0075 ,  H05B6/06 ,  H05B6/1245 ,  H05B6/36 ,  H05B6/362 ,  A61N1/3605 ,  A61N1/3756 ,  B33Y80/00 ,  H01F17/0013 ,  H01F2027/2809 ,  H04B5/0031 ,  H05K1/165 ,  H05K2201/0352 ,  Y02B40/00 ,  Y10T29/4902 ,  Y10T29/49005 ,  Y10T29/4908 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49195

摘要： A structure for wireless communication having a plurality of conductor layers, an insulator layer separating each of the conductor layers, and at least one connector connecting two of the conductor layers wherein an electrical resistance is reduced when an electrical signal is induced in the resonator at a predetermined frequency. The structure is capable of transmitting or receiving electrical energy and/or data at various near and far field magnetic coupling frequencies.

公开(公告)号：US11711981B2

公开(公告)日：2023-07-25

申请号：US17218363

申请日：2021-03-31

申请人： Brother Kogyo Kabushiki Kaisha

发明人： Hiroto Sugahara ,  Kazuo Kobayashi

IPC分类号： H10N30/20 ,  H10N30/87 ,  B41J2/14 ,  B41J2/16 ,  H10N30/074 ,  B41J2/045

CPC分类号： H10N30/875 ,  B41J2/045 ,  B41J2/14233 ,  B41J2/161 ,  B41J2/164 ,  B41J2/1623 ,  B41J2/1642 ,  B41J2/1643 ,  B41J2/1646 ,  H10N30/074 ,  H10N30/20 ,  H10N30/2047 ,  B41J2002/14266 ,  B41J2002/14491 ,  Y10T29/42 ,  Y10T29/49147 ,  Y10T29/49155

摘要： A piezoelectric actuator is disclosed that may include a insulating layer, individual electrodes, a common electrode, and a piezoelectric layer. The common electrode may include divisional electrodes that are connected with one another. The individual electrodes may be disposed between the insulating layer and the piezoelectric layer while the piezoelectric layer may be disposed between the individual electrodes and the common electrode. Further, the divisional electrodes may be configured to face the individual electrodes.

公开(公告)号：US11699632B2

公开(公告)日：2023-07-11

申请号：US17153706

申请日：2021-01-20

申请人： ALPHA ASSEMBLY SOLUTIONS INC.

发明人： Monnir Boureghda ,  Nitin Desai ,  Anna Lifton ,  Oscar Khaselev ,  Michael T. Marczi ,  Bawa Singh

IPC分类号： H05K13/04 ,  H01L23/373 ,  H01L23/00

CPC分类号： H01L23/373 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H05K13/0465 ,  H01L2224/2936 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/32225 ,  H01L2224/8384 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2924/0102 ,  H01L2924/0103 ,  H01L2924/014 ,  H01L2924/0104 ,  H01L2924/0105 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/0132 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/203 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49155 ,  Y10T428/24893 ,  H01L2224/29101 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2924/0132 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29111 ,  H01L2924/01079 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/00 ,  H01L2224/83192 ,  H01L2224/32225 ,  H01L2924/00 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2924/203 ,  H01L2924/0002

摘要： Methods for attachment and devices produced using such methods are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300° C. or less to attach the die to the substrate. Devices produced using the methods are also described.

公开(公告)号：US20180310412A1

公开(公告)日：2018-10-25

申请号：US15609131

申请日：2017-05-31

申请人： FuKui Precision Component (Shenzhen) Co., Ltd. ,  HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.

发明人： LEI ZHOU ,  RUI-WU LIU ,  QIONG ZHOU

IPC分类号： H05K1/18 ,  H05K1/09 ,  H05K3/06 ,  H05K3/18 ,  H05K1/03

CPC分类号： H05K1/189 ,  H05K1/032 ,  H05K1/09 ,  H05K3/064 ,  H05K3/188 ,  H05K2203/0723 ,  Y10T29/49155

摘要： A flexible printed circuit board with reduced ion migration from signal-carrying elements which are coated against corrosion includes an insulating layer, a wiring area, a copper electroplating layer, a nickel electroplating layer, a cover film, and a gold chemical-plating layer. The wiring area is formed on the insulating layer. The copper electroplating layer formed on the wiring area has a first portion and a second portion. The nickel electroplating layer is formed on at least the first portion and exposes sidewalls of the first portion. The cover film is formed on the second portion and fills in gaps of the copper electroplating layer. The gold chemical-plating layer is formed on top surface of the nickel electroplating layer and the sidewalls of the first portion.

公开(公告)号：US10082914B2

公开(公告)日：2018-09-25

申请号：US14836026

申请日：2015-08-26

申请人： ELO Touch Solutions, Inc.

发明人： Kyu-Tak Son

IPC分类号： H03K17/96 ,  G06F3/044

CPC分类号： G06F3/044 ,  G06F2203/04103 ,  G06F2203/04111 ,  H03K17/9622 ,  Y10T29/49155

摘要： A capacitive touch sensitive device includes a matrix of pads patterned in a first electrically conductive material on a substrate. Horizontally adjacent pads within each even row of the matrix are electrically coupled to one another via channels to form a plurality of horizontally arranged electrodes. Insulators are positioned over respective channels. Conductive links are formed over respective insulators and are configured to electrically couple vertically adjacent pads between odd rows of the matrix to form a plurality of vertically arranged electrodes. The dimensions of the channels and the conductive links are configured such that an RC time-constant (RCtc) of each of the vertically arranged electrodes substantially matches an RCtc of each of the horizontally arranged electrodes.

公开(公告)号：US20180249582A1

公开(公告)日：2018-08-30

申请号：US15966484

申请日：2018-04-30

申请人： AbleGo Technology Co., Ltd.

发明人： Shu-Hui Hung

IPC分类号： H05K3/30

CPC分类号： H05K3/305 ,  H05K2201/10977 ,  H05K2203/0195 ,  Y02P70/613 ,  Y10T29/49155 ,  Y10T29/5193

摘要： This invention provides a method and apparatus for manufacturing electronic devices. The method includes: providing a substrate having a first surface; providing an electronic device having bumps; mounting the bumps to the first surface to form an integrated unit; applying a capillary underfill to multiple sides of the electronic device, enabling the underfill to creep along and fill the gap between the electronic device and the substrate; placing the integrated unit into a processing chamber; raising the temperature in the chamber to a first predetermined temperature; reducing the pressure in the chamber to a first predetermined pressure of a vacuum pressure, and maintaining the vacuum pressure for a predetermined time period; raising the pressure in the chamber to a second predetermined pressure higher than 1 atm, and maintaining the second predetermined pressure for a predetermined time period; and adjusting the temperature in the chamber to a second predetermined temperature.

公开(公告)号：US20180240781A1

公开(公告)日：2018-08-23

申请号：US15961865

申请日：2018-04-24

申请人： CYNTEC CO., LTD.

发明人： BAU-RU LU ,  MING-CHIA WU ,  SHAO WEI LU

IPC分类号： H01L25/065 ,  H05K7/20 ,  H05K3/42 ,  H05K1/11 ,  H05K5/06 ,  H05K5/02 ,  H01L23/552 ,  H01L25/00 ,  H01L23/13 ,  H01L23/373 ,  H01L23/538 ,  H01L23/31 ,  H01L23/40 ,  H01L23/36 ,  H01L23/498 ,  H05K7/02

CPC分类号： H01L25/0655 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/36 ,  H01L23/3735 ,  H01L23/4006 ,  H01L23/49811 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/18 ,  H01L25/072 ,  H01L25/117 ,  H01L25/50 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/13055 ,  H01L2924/13091 ,  H05K1/115 ,  H05K3/42 ,  H05K5/0247 ,  H05K5/065 ,  H05K7/02 ,  H05K7/20509 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00014 ,  H01L2924/00

摘要： The present invention discloses a three-dimensional package structure which can achieve a relatively high utilization of an internal space thereof, so that a size of electronic package structure can be reduced. The three-dimensional package structure comprises a first electronic component, a plurality of second electronic components and a plurality of conductive patterns. The first electronic component has a top surface and a bottom surface. The plurality of second electronic components are disposed over the top surface of the first electronic component. The plurality of conductive patterns are disposed over the plurality of second electronic components to electrically connect the plurality of second electronic components and the first electronic component.

公开(公告)号：US10038958B1

公开(公告)日：2018-07-31

申请号：US14746149

申请日：2015-06-22

申请人： Lockheed Martin Corporation

发明人： Todd C. Gloo ,  James D. Weigner ,  Raymond Porzio

IPC分类号： H01L41/08 ,  H04R17/00 ,  H01L41/083

CPC分类号： H04R17/00 ,  H01L41/083 ,  H01L41/183 ,  H01L41/187 ,  H01L41/27 ,  H01L41/273 ,  H01L41/277 ,  H01L41/29 ,  H01L41/293 ,  H01L41/297 ,  H01L41/337 ,  H01L41/338 ,  H03H3/02 ,  Y10T29/42 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49155

摘要： A tape cast transducer element assembly comprises a tape cast transducer element including a multi-layer piezoelectric stack diced from a sintered piezoelectric body formed from a plurality of thin film tape layers, the film thin tape layers sintered to produce a final density. A conductive film coats select ones of the thin film tape layers such that conductive layers of different polarities are exposed on opposing sides of the multi-layer piezoelectric stack. Electrodes are coupled to the conductive layers. Electrical leads are coupled to each electrode. A head mass is configured to encapsulate a top portion of the stack. A tail mass is configured to encapsulate a bottom portion of the stack. At least one coupling arrangement extends from a top surface of the head mass through the cross-sectional area of the head mass into the tail mass such that the stack is contained in a rigid assembly under compression.