公开(公告)号：US5038052A

公开(公告)日：1991-08-06

申请号：US271650

申请日：1988-11-16

申请人： Satarou Yamaguchi ,  Ichiro Nakazawa ,  Minoru Yamane

发明人： Satarou Yamaguchi ,  Ichiro Nakazawa ,  Minoru Yamane

IPC分类号： G21B1/21 ,  H02M9/00 ,  H03K3/57 ,  H05H1/12

CPC分类号： G21B1/21 ,  H03K3/57

摘要： A double swing power unit for use in a plasma nuclear fusion experimental system comprising a bias bank, a bias switch provided by a semiconductor switch element having a rectifying function, a decoupling inductor, and a load coil connected in series, a series connection of a reverse switch and a reverse bank and a series connection of a hold switch and a hold bank, both thereof being connected in parallel with the load coil, and a control switch connected in parallel with the bias switch.

摘要翻译： 一种用于等离子体核聚变实验系统的双摆动功率单元，包括偏置组，由具有整流功能的半导体开关元件提供的偏置开关，去耦电感器和串联连接的负载线圈，串联连接 反向开关和反向组以及保持开关和保持组的串联连接，它们均与负载线圈并联连接，以及与偏置开关并联连接的控制开关。

公开(公告)号：US06410615B1

公开(公告)日：2002-06-25

申请号：US09485389

申请日：2000-02-09

申请人： Takashi Taniguchi ,  Minoru Yamane ,  Tsutomu Nishioka ,  Tadaaki Harada ,  Toshitsugu Hosokawa ,  Kazuhiro Ikemura ,  Sadahito Misumi ,  Shinichi Ohizumi

发明人： Takashi Taniguchi ,  Minoru Yamane ,  Tsutomu Nishioka ,  Tadaaki Harada ,  Toshitsugu Hosokawa ,  Kazuhiro Ikemura ,  Sadahito Misumi ,  Shinichi Ohizumi

IPC分类号： C08L6300

CPC分类号： H01L23/293 ,  C08L63/00 ,  H01L2224/45144 ,  H01L2224/48091 ,  Y10S524/904 ,  Y10S525/934 ,  C08L61/04 ,  C08L2666/22 ,  H01L2924/00014 ,  H01L2924/00

摘要： An epoxy resin composition for semiconductor encapsulation comprising an epoxy resin, a phenolic resin, a hardening accelerator and an inorganic filler. The epoxy resin composition having the following properties (X) to (Z) does not cause the chip tilting attributable to resin flow during resin encapsulation, such as semiconductor element shifting or gold wire deformation, and can obtain highly reliable semiconductor devices: (X) the viscosity thereof as measured with a flow tester at 175° C. is from 50 to 500 P; (Y) the minimum melt viscosity thereof as determined from the temperature dependence of viscosity thereof as measured with a dynamic viscoelastic meter at a shear rate of 5 (1/s) is 1×105 poise or lower; and (Z) the ratio of the viscosity thereof as measured at 90° C. (Z1) to that as measured at 110° C. (Z2) both with a dynamic viscoelastic meter at a shear rate of 5 (1/s), (Z1/Z2), is 2.0 or higher.

摘要翻译： 一种用于半导体封装的环氧树脂组合物，包括环氧树脂，酚醛树脂，硬化促进剂和无机填料。 具有以下特性（X）至（Z）的环氧树脂组合物不会由于树脂封装中的树脂流动（例如半导体元件偏移或金线变形）而引起芯片倾斜，并且可以获得高度可靠的半导体器件：（X） 用流动测试仪在175℃下测得的粘度为50-500P;（Y）其最小熔体粘度由粘度的温度依赖性确定，其用动态粘弹性仪器在剪切速率 5（1 / s）为1×10 5泊或更低; 和（Z）在90℃（Z1）下测量的粘度与在110℃下测量的粘度（Z2）的比例，用剪切速率为5（1 / s）的动态粘弹性仪， （Z1 / Z2）为2.0以上。

公开(公告)号：US6070527A

公开(公告)日：2000-06-06

申请号：US811257

申请日：1997-03-04

申请人： Minoru Yamane ,  Osamu Majima

发明人： Minoru Yamane ,  Osamu Majima

IPC分类号： B41C1/05 ,  B41M1/10 ,  B41N1/00 ,  B41N1/12

CPC分类号： B41N1/06 ,  B41C1/05 ,  B41N1/12 ,  B41M1/10 ,  B41N1/22

摘要： A plate material for laser plate making contains a thermoplastic resin, a light absorbing agent and a water repellent or an oil repellent.

摘要翻译： 用于激光制版的板材包含热塑性树脂，光吸收剂和防水剂或拒油剂。

公开(公告)号：US20050023715A1

公开(公告)日：2005-02-03

申请号：US10892186

申请日：2004-07-16

申请人： Hirofumi Oono ,  Minoru Yamane ,  Yasunobu Ina ,  Shouichi Umeno

发明人： Hirofumi Oono ,  Minoru Yamane ,  Yasunobu Ina ,  Shouichi Umeno

IPC分类号： H01L21/56 ,  B29B9/04 ,  B29B9/08 ,  B29B9/10 ,  B29B9/12 ,  B29C45/46 ,  H01L23/28 ,  H01L23/29

CPC分类号： B29C45/462 ,  B29B9/04 ,  B29B9/08 ,  B29B9/10 ,  B29B9/12 ,  B29K2063/00 ,  H01L23/293 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method for producing a semiconductor-molding tablet, which can reduce formation of voids in the package due to increased density of the tablet. The method comprises a step of kneading an epoxy resin composition comprising components (A) an epoxy resin, (B) a phenol resin, and (C) an inorganic filler as essential components, a step of roll-molding the resulting kneaded composition into a sheet shape having a sheet density ratio of 98% or more, a step of pulverizing the resulting sheet-shaped compact, and a step of forming the pulverized material into a tablet shape having a tablet density ratio of 94% or more and less than 98%.

摘要翻译： 一种用于制造半导体成型片剂的方法，其可以由于片剂的密度增加而减少包装中空隙的形成。 该方法包括将包含（A）环氧树脂，（B）酚醛树脂和（C）无机填料）作为必要组分的环氧树脂组合物捏合的步骤，将所得捏合组合物辊压成型为 具有98％以上的片材密度比的片状，对所得片状成形体进行粉碎的工序，以及将粉碎物形成为片状密度为94％以上且小于98的片状的工序 ％。