公开(公告)号：US20050023715A1

公开(公告)日：2005-02-03

申请号：US10892186

申请日：2004-07-16

申请人： Hirofumi Oono ,  Minoru Yamane ,  Yasunobu Ina ,  Shouichi Umeno

发明人： Hirofumi Oono ,  Minoru Yamane ,  Yasunobu Ina ,  Shouichi Umeno

IPC分类号： H01L21/56 ,  B29B9/04 ,  B29B9/08 ,  B29B9/10 ,  B29B9/12 ,  B29C45/46 ,  H01L23/28 ,  H01L23/29

CPC分类号： B29C45/462 ,  B29B9/04 ,  B29B9/08 ,  B29B9/10 ,  B29B9/12 ,  B29K2063/00 ,  H01L23/293 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method for producing a semiconductor-molding tablet, which can reduce formation of voids in the package due to increased density of the tablet. The method comprises a step of kneading an epoxy resin composition comprising components (A) an epoxy resin, (B) a phenol resin, and (C) an inorganic filler as essential components, a step of roll-molding the resulting kneaded composition into a sheet shape having a sheet density ratio of 98% or more, a step of pulverizing the resulting sheet-shaped compact, and a step of forming the pulverized material into a tablet shape having a tablet density ratio of 94% or more and less than 98%.

摘要翻译： 一种用于制造半导体成型片剂的方法，其可以由于片剂的密度增加而减少包装中空隙的形成。 该方法包括将包含（A）环氧树脂，（B）酚醛树脂和（C）无机填料）作为必要组分的环氧树脂组合物捏合的步骤，将所得捏合组合物辊压成型为 具有98％以上的片材密度比的片状，对所得片状成形体进行粉碎的工序，以及将粉碎物形成为片状密度为94％以上且小于98的片状的工序 ％。