公开(公告)号：US20100025080A1

公开(公告)日：2010-02-04

申请号：US12512588

申请日：2009-07-30

申请人： Se-Ho PARK ,  Ki-Huyn KIM ,  Seok-Myong KANG ,  Young-Min LEE

发明人： Se-Ho PARK ,  Ki-Huyn KIM ,  Seok-Myong KANG ,  Young-Min LEE

IPC分类号： H05K1/00 ,  H05K3/10

CPC分类号： H05K3/246 ,  H05K1/092 ,  H05K1/095 ,  H05K2201/0347 ,  H05K2203/1131 ,  Y10T29/49155

摘要： A Printed Circuit Board (PCB) and a method for manufacturing the same are provided. A circuit pattern is formed by printing conductive ink/paste on a substrate, and sintering a layer of the conductive ink or curing a layer of the conductive paste by applying heat. A primary plating layer is formed through electroless plating or electrolytic plating of a high-melting point metal on the circuit pattern. A secondary plating layer is formed through electroless plating or electrolytic plating of a precious metal on the primary plating layer to improve wetting with solder.

摘要翻译： 提供印刷电路板（PCB）及其制造方法。 通过在基板上印刷导电油墨/糊料，并且通过加热来烧结导电油墨层或固化导电浆料层而形成电路图案。 通过电路图案上的高熔点金属的化学镀或电解电镀形成初级镀层。 通过在主镀层上的贵金属的化学镀或电解电镀形成二次镀层，以改善用焊料的润湿。