HYBRID STORAGE DEVICE PARTITIONS WITH STORAGE TIERS

    公开(公告)号:US20190286355A1

    公开(公告)日:2019-09-19

    申请号:US15920264

    申请日:2018-03-13

    Abstract: A hybrid storage device includes a first storage medium configured to store data at a first speed and a second storage medium configured to store data at a second speed. The first storage medium may be a NAND flash storage medium, and the second storage medium may be disc storage medium. Partitions of the first storage medium are associated with partitions of the second storage medium to form at least two storage tiers. Each of the storage tiers may include different NAND partition capacities. The storage device further includes a peer to peer communication channel between the first storage medium and the second storage medium for moving data between a NAND partition and HDD partition. The storage device is accessible via a dual port SAS or PCIe interface.

    Data storage system and a method of cooling a data storage system
    3.
    发明授权
    Data storage system and a method of cooling a data storage system 有权
    数据存储系统和数据存储系统的冷却方法

    公开(公告)号:US09535471B2

    公开(公告)日:2017-01-03

    申请号:US13773530

    申请日:2013-02-21

    CPC classification number: G06F1/206 H05K7/20727

    Abstract: A data storage system and a method of cooling the data storage system are presented. The data storage system includes: an enclosure; one or more drawer structures disposed within the enclosure, wherein at least one of the drawer structures is configured to receive one or more electronic devices; and one or more temperature control elements positioned adjacent to the bottom of the at least one drawer structure, wherein at least one of the temperature control elements is arranged in use to thermally communicate with at least one of the electronic devices.

    Abstract translation: 提出了一种数据存储系统和一种冷却数据存储系统的方法。 数据存储系统包括:外壳; 设置在所述外壳内的一个或多个抽屉结构,其中所述抽屉结构中的至少一个构造成容纳一个或多个电子设备; 以及与所述至少一个抽屉结构的底部相邻定位的一个或多个温度控制元件,其中至少一个所述温度控制元件在使用中被布置成与所述电子设备中的至少一个热连通。

    SOLID STATE STORAGE SYSTEM
    5.
    发明申请
    SOLID STATE STORAGE SYSTEM 有权
    固态储存系统

    公开(公告)号:US20150277512A1

    公开(公告)日:2015-10-01

    申请号:US14640986

    申请日:2015-03-06

    CPC classification number: G06F1/183 G06F1/187

    Abstract: The invention provides a storage system comprising a solid state storage carrier sized to correspond to a defined storage form factor and to include a support printed circuit board (PCB) having arranged thereon a plurality of solid state storage devices. The storage system can include a storage enclosure including a midplane and at least one slot on an end of the storage enclosure, sized to receive a solid state storage carrier for connection with the midplane in the storage enclosure. The storage system can also include at least one midplane connector located on the midplane, wherein the at least one midplane connector is configured to mate with at least one form factor connector on an end of the solid state storage carrier.

    Abstract translation: 本发明提供了一种存储系统,其包括固定状态的存储载体,其尺寸对应于限定的存储形状因子,并且包括其上布置有多个固态存储装置的支撑印刷电路板(PCB)。 存储系统可以包括存储壳体,其包括中平面和存储壳体的端部上的至少一个槽,其尺寸被设计成接收用于与存储壳体中的中平面连接的固态存储载体。 存储系统还可以包括位于中平面上的至少一个中平面连接器,其中所述至少一个中平面连接器被配置为与固态存储载体的端部上的至少一个形状因数连接器配合。

    Enclosure system for computing equipment

    公开(公告)号:US10025357B2

    公开(公告)日:2018-07-17

    申请号:US14740081

    申请日:2015-06-15

    Abstract: The disclosed technology provides an enclosure system for computing equipment and a method for manufacturing an enclosure system, which includes a front enclosure base configured to secure a plurality of tray modules, each of the plurality of tray modules comprising a printed circuit board to connect a plurality of electronic components and being connected at a rear end to a connectivity midplane. The front enclosure base has a front end taller than the rear end such that the front end is configured to structurally support the plurality of tray modules and the rear end allows connecting rear faces of each of the plurality of tray modules to the connectivity midplane.

    Solid state storage system
    7.
    发明授权

    公开(公告)号:US09746886B2

    公开(公告)日:2017-08-29

    申请号:US14640986

    申请日:2015-03-06

    CPC classification number: G06F1/183 G06F1/187

    Abstract: The invention provides a storage system comprising a solid state storage carrier sized to correspond to a defined storage form factor and to include a support printed circuit board (PCB) having arranged thereon a plurality of solid state storage devices. The storage system can include a storage enclosure including a midplane and at least one slot on an end of the storage enclosure, sized to receive a solid state storage carrier for connection with the midplane in the storage enclosure. The storage system can also include at least one midplane connector located on the midplane, wherein the at least one midplane connector is configured to mate with at least one form factor connector on an end of the solid state storage carrier.

    ENCLOSURE SYSTEM FOR COMPUTING EQUIPMENT
    8.
    发明申请
    ENCLOSURE SYSTEM FOR COMPUTING EQUIPMENT 有权
    用于计算设备的外壳系统

    公开(公告)号:US20160363966A1

    公开(公告)日:2016-12-15

    申请号:US14740081

    申请日:2015-06-15

    CPC classification number: G06F1/187 G06F1/20 G11B33/00 G11B33/128

    Abstract: The disclosed technology provides an enclosure system for computing equipment and a method for manufacturing an enclosure system, which includes a front enclosure base configured to secure a plurality of tray modules, each of the plurality of tray modules comprising a printed circuit board to connect a plurality of electronic components and being connected at a rear end to a connectivity midplane. The front enclosure base has a front end taller than the rear end such that the front end is configured to structurally support the plurality of tray modules and the rear end allows connecting rear faces of each of the plurality of tray modules to the connectivity midplane.

    Abstract translation: 所公开的技术提供了一种用于计算设备的外壳系统和用于制造外壳系统的方法,所述外壳系统包括被配置为固定多个托盘模块的前壳体基座,所述多个托盘模块中的每一个包括印刷电路板以连接多个 的电子部件并且在后端连接到连接中平面。 前壳体底座具有比后端高的前端,使得前端被构造成在多个托盘模块中结构地支撑,并且后端允许将多个托盘模块中的每一个的后表面连接到连接中平面。

Patent Agency Ranking