公开(公告)号：US11246251B2

公开(公告)日：2022-02-08

申请号：US16402054

申请日：2019-05-02

Applicant: Seagate Technology LLC

Inventor： Michael J Conover ,  Javier I Guzman ,  I-Fei Tsu ,  Joseph J Schobel

IPC: H05K13/08 ,  H05K13/04 ,  B25J7/00 ,  B25J19/02

Abstract: A system includes a computing device with circuitry and memory with instructions for execution by the circuitry. The instructions include monitoring signals indicative of a non-uniform distance between a transfer head and a receiving substrate, and, in response to the monitored signals, actuating one or more actuators towards the transfer head or the receiving substrate to deform the transfer head or the receiving substrate.

公开(公告)号：US09886970B1

公开(公告)日：2018-02-06

申请号：US15255090

申请日：2016-09-01

Applicant: Seagate Technology LLC

Inventor： Todd Michael Lammers ,  JianHua Xue ,  Javier I Guzman ,  Andrew Thomas Jaeb ,  Bruce Douglas Buch

IPC: G11B20/20 ,  G11B5/09 ,  G11B5/17 ,  G11B5/48

CPC classification number: G11B5/09 ,  G11B5/17 ,  G11B5/4853

Abstract: In certain embodiments, an apparatus may comprise a first output driver connected to a first output via a first trace and a second output driver connected to a second output via a second trace. The first output driver may be configured to output a first drive signal to the first output to drive the first output and the first drive signal may cause first induced noise in the second trace. Further, the second output driver may be configured to output a second drive signal based on the first drive signal where the second drive signal may reduce the magnitude of the first induced noise at the second output.

公开(公告)号：US10923378B2

公开(公告)日：2021-02-16

申请号：US16410874

申请日：2019-05-13

Applicant: Seagate Technology LLC

Inventor： Javier I Guzman ,  I-Fei Tsu ,  Michael J Conover ,  Declan Macken

IPC: H01L21/68 ,  H01L33/62 ,  H01L21/67

Abstract: A method for transferring components from a transfer head to a receiving substrate is disclosed. The method includes monitoring signals indicative of a pitch mismatch between locations on the transfer head and locations on the receiving substrate and actuating at least one actuator based at least in part on the monitored signals to reduce the mismatch of the pitch of the locations on the transfer head and the locations on the receiving substrate.

公开(公告)号：US20200352070A1

公开(公告)日：2020-11-05

申请号：US16402054

申请日：2019-05-02

Applicant: Seagate Technology LLC

Inventor： Michael J Conover ,  Javier I Guzman ,  I-Fei Tsu ,  Joseph J Schobel

IPC: H05K13/08 ,  B25J7/00 ,  B25J19/02 ,  H05K13/04

Abstract: A system includes a computing device with circuitry and memory with instructions for execution by the circuitry. The instructions include monitoring signals indicative of a non-uniform distance between a transfer head and a receiving substrate, and, in response to the monitored signals, actuating one or more actuators towards the transfer head or the receiving substrate to deform the transfer head or the receiving substrate.