公开(公告)号：US10399177B1

公开(公告)日：2019-09-03

申请号：US15909429

申请日：2018-03-01

Applicant: Seagate Technology LLC

Inventor： Jerome Thomas Coffey ,  Samuel Edward Severson ,  David G. Fitzgerald ,  Jeffrey L. Bruce ,  David R. Lapp ,  Darrel R. Culver

IPC: G11B33/02 ,  B23K20/12 ,  H05K5/04 ,  H05K5/06 ,  H05K5/03 ,  G11B33/04 ,  B23K101/36

Abstract: Described are enclosures that include a friction stir weld, including electronic device enclosures, and precursors thereof, that contain a base and a cover that in an assembled condition form a joint at which a friction stir weld can be produced, as well as methods for producing a friction stir weld at a joint of such an assembly.

公开(公告)号：US20200038990A1

公开(公告)日：2020-02-06

申请号：US16558557

申请日：2019-09-03

Applicant: Seagate Technology LLC.

Inventor： Jerome Thomas Coffey ,  Samuel Edward Severson ,  David G. Fitzgerald ,  Jeffrey L. Bruce ,  David R. Lapp ,  Darrel R. Culver

IPC: B23K20/12 ,  G11B33/04 ,  G11B33/02 ,  H05K5/04 ,  H05K5/06 ,  H05K5/03

Abstract: Described are enclosures that include a friction stir weld, including electronic device enclosures, and precursors thereof, that contain a base and a cover that in an assembled condition form a joint at which a friction stir weld can be produced, as well as methods for producing a friction stir weld at a joint of such an assembly.