公开(公告)号：US09788100B2

公开(公告)日：2017-10-10

申请号：US14590421

申请日：2015-01-06

Applicant: SENNHEISER COMMUNICATIONS A/S

Inventor： Mohamad Essabar ,  Peter Vestergaard Værum ,  Bo Skjoldborg ,  Christian Ern

IPC: H04R5/033 ,  H04R1/10

CPC classification number: H04R1/1058 ,  H04R1/1033 ,  H04R1/105 ,  H04R5/0335

Abstract: A headphone with over the head passage and two earphone housings is provided, with one housing attached at each end of the over the head passage at attachment areas thereof, and an electrical lead element passing between the over the head passage and the earphone housing. The over the head passage is connected at the attachment area to an earphone housing at an earphone attachment site arranged externally of the earphone housing, and the earphone housing comprise a lead element opening spaced from the earphone attachment site. The lead element opening is larger than the electrical lead element and the lead element is slidably arranged in the lead element opening.

公开(公告)号：USD857656S1

公开(公告)日：2019-08-27

申请号：US29638413

申请日：2018-02-27

Applicant: Sennheiser Communications A/S

Designer： Klaus Sommer Ipsen ,  Lars Elliot Nyegaard ,  Peter Vestergaard Værum ,  Andreas Jessen ,  Bo Skjoldborg