Antenna application in wireless earphones

    公开(公告)号:US12114421B2

    公开(公告)日:2024-10-08

    申请号:US18138437

    申请日:2023-04-24

    Abstract: A wireless earphone incorporates a wire antenna having a form factor driven innovative antenna shape that minimizes antenna detuning caused by user interactions with the earphones. The wire shape, diameter, and distance of the wire antenna from the printed circuit board (PCB) are selected for an acceptable tradeoff between antenna bandwidth and radiated efficiency. By inserting an end through a through-hole of the PCB, the wire antenna is electrically connected to a multi-layer PCB without traditional approaches such as springs, pogo pins, and the like. An antenna holder further secures the antenna within a thin profile housing for precise placement and manufacturing consistency. A PCB-specific RF VIA geometry is also utilized for partial impedance matching of a transmission line to the wire antenna. In addition, a more constant impedance is maintained along the transmission line connecting a radio device with the wire antenna.

    Downlead Cable
    7.
    发明公开
    Downlead Cable 审中-公开

    公开(公告)号:US20230199100A1

    公开(公告)日:2023-06-22

    申请号:US18005997

    申请日:2021-07-29

    Abstract: A downlead cable includes a first connector configured to connect to a headset of a communication system. A second connector is configured to connect to a connection port of a handset or a radio system. The downlead cable further includes wires connecting the first and second connectors and a cable jacket encapsulating the wires. A transformer is wired inline between the first and second connectors. The transformer is configured to enable the headset to mimic the electrical characteristics a microphone which the handset or the radio system is configured to interface.

    CABLE ASSEMBLIES FOR HEADPHONE DEVICES
    8.
    发明公开

    公开(公告)号:US20230143704A1

    公开(公告)日:2023-05-11

    申请号:US18149716

    申请日:2023-01-04

    Applicant: Sonos, Inc.

    CPC classification number: H04R1/1033 H04R1/04 H04R5/033 H01B7/26

    Abstract: Headphone playback devices can include a cable assembly including a plurality of conductors extending between a first earpiece and a second earpiece. The cable assembly includes a jacket, a power conductor disposed within the jacket and coupled between a power source in the first earpiece and a wireless transceiver in the second earpiece. The cable assembly further includes a microphone conductor at least partially disposed within the jacket and coupled to a microphone in one of the earpieces. A shield is at least partially disposed between the power conductor and the microphone conductor to reduce electromagnetic interference between the two.

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