公开(公告)号：US20170194238A1

公开(公告)日：2017-07-06

申请号：US15069387

申请日：2016-03-14

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Ching-Wen Chiang ,  Hsin-Chih Wang ,  Chih-Yuan Shih ,  Shih-Ching Chen

IPC: H01L23/498 ,  H01L21/56 ,  H01L21/306 ,  H01L21/48 ,  H01L21/304

CPC classification number: H01L23/49827 ,  H01L21/304 ,  H01L21/306 ,  H01L21/486 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49833 ,  H01L2224/16225

Abstract: A substrate structure is provided, which includes: a substrate body having a first surface and a second surface opposite to the first surface; and a plurality of conductive posts disposed on the first surface of the substrate body and electrically connected to the substrate body. By replacing conventional through silicon vias (TSVs) with the conductive posts, the present disclosure greatly reduces the fabrication cost. The present disclosure further provides an electronic package having the substrate structure and a method for fabricating the electronic package.

公开(公告)号：US20170330826A1

公开(公告)日：2017-11-16

申请号：US15666005

申请日：2017-08-01

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Ching-Wen Chiang ,  Hsin-Chih Wang ,  Chih-Yuan Shih ,  Shih-Ching Chen

IPC: H01L23/498 ,  H01L21/56 ,  H01L21/48 ,  H01L21/306 ,  H01L21/304

CPC classification number: H01L23/49827 ,  H01L21/304 ,  H01L21/306 ,  H01L21/486 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49833 ,  H01L2224/16225

Abstract: A substrate structure is provided, which includes: a substrate body having a first surface and a second surface opposite to the first surface; and a plurality of conductive posts disposed on the first surface of the substrate body and electrically connected to the substrate body. By replacing conventional through silicon vias (TSVs) with the conductive posts, the present disclosure greatly reduces the fabrication cost. The present disclosure further provides an electronic package having the substrate structure and a method for fabricating the electronic package.

公开(公告)号：US10096541B2

公开(公告)日：2018-10-09

申请号：US15666005

申请日：2017-08-01

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Ching-Wen Chiang ,  Hsin-Chih Wang ,  Chih-Yuan Shih ,  Shih-Ching Chen

IPC: H01L23/00 ,  H01L23/498 ,  H01L21/56 ,  H01L21/306 ,  H01L21/304 ,  H01L21/48

Abstract: A substrate structure is provided, which includes: a substrate body having a first surface and a second surface opposite to the first surface; and a plurality of conductive posts disposed on the first surface of the substrate body and electrically connected to the substrate body. By replacing conventional through silicon vias (TSVs) with the conductive posts, the present disclosure greatly reduces the fabrication cost. The present disclosure further provides an electronic package having the substrate structure and a method for fabricating the electronic package.

公开(公告)号：US09754868B2

公开(公告)日：2017-09-05

申请号：US15069387

申请日：2016-03-14

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Ching-Wen Chiang ,  Hsin-Chih Wang ,  Chih-Yuan Shih ,  Shih-Ching Chen

IPC: H01L21/50 ,  H01L23/498 ,  H01L21/48 ,  H01L21/304 ,  H01L21/306 ,  H01L21/56

CPC classification number: H01L23/49827 ,  H01L21/304 ,  H01L21/306 ,  H01L21/486 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49833 ,  H01L2224/16225

Abstract: A substrate structure is provided, which includes: a substrate body having a first surface and a second surface opposite to the first surface; and a plurality of conductive posts disposed on the first surface of the substrate body and electrically connected to the substrate body. By replacing conventional through silicon vias (TSVs) with the conductive posts, the present disclosure greatly reduces the fabrication cost. The present disclosure further provides an electronic package having the substrate structure and a method for fabricating the electronic package.