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公开(公告)号:US09275893B2
公开(公告)日:2016-03-01
申请号:US14426509
申请日:2013-04-10
Applicant: Soitec
Inventor: Alexandre Barthelemy
IPC: H01L21/762
CPC classification number: H01L21/76259 , H01L21/76254
Abstract: The present disclosure concerns a method of detaching a layer to be detached from a donor substrate, comprising the following steps: a) assembling the donor substrate and a porous substrate, b) application of a treatment of chemical modification of the crystallites, the chemical modification being adapted to generate a variation of the volume of the crystallites, the volume variation generates deformation in compression or in tension of the porous substrate, the deformation in compression or in tension generates a stress in tension or in compression in the donor substrate, which causes fracture in a fracture plane, the fracture plane delimiting the layer to be detached, the stress leading to the detachment of the layer to be detached from the donor substrate.
Abstract translation: 本公开涉及一种从施主衬底分离待分离的层的方法,包括以下步骤:a)组合施主衬底和多孔衬底,b)施加微晶化学改性的处理,化学改性 适于产生微晶体积的变化,体积变化在多孔基材的压缩或张力中产生变形,压缩或拉伸中的变形在供体基底中产生张力或压缩中的应力,这导致 在断裂平面中断裂,限定要分离的层的断裂面,导致从供体基底脱离的层的应力。
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公开(公告)号:US09835377B2
公开(公告)日:2017-12-05
申请号:US14425549
申请日:2013-08-20
Applicant: Soitec
Inventor: Christophe Gourdel , Alexandre Barthelemy
IPC: F27D5/00
CPC classification number: F27D5/0037
Abstract: A support device that has a central axis and includes three uprights extending substantially parallel to the central axis, a plurality of series of support members spaced along the central axis, each series of support members comprising three support members adapted to support one wafer of the plurality of wafers and extending in different essentially longitudinal directions transverse to the central axis, each support member being mounted directly on a separate upright, this support device being remarkable in that the directions of the three support members of each series of support members are concurrent at a point on the central axis.
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公开(公告)号:US20150243551A1
公开(公告)日:2015-08-27
申请号:US14426509
申请日:2013-04-10
Applicant: SOITEC
Inventor: Alexandre Barthelemy
IPC: H01L21/762
CPC classification number: H01L21/76259 , H01L21/76254
Abstract: The present disclosure concerns a method of detaching a layer to be detached from a donor substrate, comprising the following steps: a) assembling the donor substrate and a porous substrate, b) application of a treatment of chemical modification of the crystallites, the chemical modification being adapted to generate a variation of the volume of the crystallites, the volume variation generates deformation in compression or in tension of the porous substrate, the deformation in compression or in tension generates a stress in tension or in compression in the donor substrate, which causes fracture in a fracture plane, the fracture plane delimiting the layer to be detached, the stress leading to the detachment of the layer to be detached from the donor substrate.
Abstract translation: 本公开涉及一种从施主衬底分离待分离的层的方法,包括以下步骤:a)组合施主衬底和多孔衬底,b)施加微晶化学改性的处理,化学改性 适于产生微晶体积的变化,体积变化在多孔基材的压缩或张力中产生变形,压缩或拉伸中的变形在供体基底中产生张力或压缩中的应力,这导致 在断裂平面中断裂,限定要分离的层的断裂面,导致从供体基底脱离的层的应力。
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公开(公告)号:US20150211800A1
公开(公告)日:2015-07-30
申请号:US14425549
申请日:2013-08-20
Applicant: Soitec
Inventor: Christophe Gourdel , Alexandre Barthelemy
IPC: F27D5/00
CPC classification number: F27D5/0037
Abstract: This support device has a central axis and includes: three uprights extending substantially parallel to the central axis, a plurality of series of support members spaced along the central axis, each series of support members comprising three support members adapted to support one wafer of the plurality of wafers and extending in different essentially longitudinal directions transverse to the central axis, each support member being mounted directly on a separate upright, this support device being remarkable in that the directions of the three support members of each series of support members are concurrent at a point on the central axis.
Abstract translation: 该支撑装置具有中心轴线并且包括:基本上平行于中心轴线延伸的三个立柱,沿着中心轴线间隔开的多个一系列支撑构件,每个系列支撑构件包括三个支撑构件,其适于支撑多个 的晶片并且沿与中心轴线横截的不同的基本上纵向方向延伸,每个支撑构件直接安装在单独的直立上,该支撑装置显着,其中每个支撑构件的三个支撑构件的方向在一个 指向中心轴。
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