HEAT RADIATION MEMBER
    1.
    发明申请

    公开(公告)号:US20210398877A1

    公开(公告)日:2021-12-23

    申请号:US17289259

    申请日:2019-08-30

    IPC分类号: H01L23/373 B23K1/00 B23K35/32

    摘要: A heat radiation member excellent in electrical insulation and better in thermal conduction is provided. The heat radiation member includes a substrate composed of a composite material containing diamond and a metallic phase, an insulating plate provided on at least a part of front and rear surfaces of the substrate and composed of an aluminum nitride, and a single bonding layer interposed between the substrate and the insulating plate, the heat radiation member having thermal conductivity not lower than 400 W/m·K.