公开(公告)号：US09873159B2

公开(公告)日：2018-01-23

申请号：US14983954

申请日：2015-12-30

Applicant: SunEdison, Inc.

Inventor： Omid Rezvanian ,  Larry Wayne Shive ,  Rituraj Nandan ,  Dale A. Witte ,  Edward Calvin

IPC: B28D1/06 ,  B23D65/00 ,  B23D61/18 ,  B28D5/04

CPC classification number: B23D65/00 ,  B23D61/185 ,  B28D5/045

Abstract: A method for designing a diamond coated wire for use in a wafer slicing system includes adjusting an initial diamond size distribution until an intermediate diamond size distribution is generated, wherein the intermediate diamond size distribution has a corresponding simulated penetration thickness value less than or equal a predetermined penetration thickness value, and wherein penetration thickness is a parameter proportional to a depth of subsurface damage that would occur when slicing an ingot using a diamond coated wire having an associated diamond size distribution. The method may include adjusting the intermediate diamond size distribution until a final diamond size distribution is generated, wherein the final diamond size distribution has a maximum diamond grit size that is substantially equal to a predetermined maximum diamond grit size, and manufacturing the diamond coated wire such that the diamond coated wire has a plurality of diamond grits that fit the final diamond size distribution.

公开(公告)号：US20160184909A1

公开(公告)日：2016-06-30

申请号：US14983954

申请日：2015-12-30

Applicant: SunEdison, Inc.

Inventor： Omid Rezvanian ,  Larry Wayne Shive ,  Rituraj Nandan ,  Dale A. Witte ,  Edward Calvin

IPC: B23D65/00 ,  B28D5/04 ,  B23D61/18

CPC classification number: B23D65/00 ,  B23D61/185 ,  B28D5/045

Abstract: A method for designing a diamond coated wire for use in a wafer slicing system includes adjusting an initial diamond size distribution until an intermediate diamond size distribution is generated, wherein the intermediate diamond size distribution has a corresponding simulated penetration thickness value less than or equal a predetermined penetration thickness value, and wherein penetration thickness is a parameter proportional to a depth of subsurface damage that would occur when slicing an ingot using a diamond coated wire having an associated diamond size distribution. The method may include adjusting the intermediate diamond size distribution until a final diamond size distribution is generated, wherein the final diamond size distribution has a maximum diamond grit size that is substantially equal to a predetermined maximum diamond grit size, and manufacturing the diamond coated wire such that the diamond coated wire has a plurality of diamond grits that fit the final diamond size distribution.

Abstract translation: 用于设计用于晶片切片系统的金刚石涂层线的方法包括调整初始金刚石尺寸分布直到产生中间金刚石尺寸分布，其中中间金刚石尺寸分布具有小于或等于预定的相应模拟穿透厚度值 穿透厚度值，并且其中穿透厚度是与使用具有相关联的金刚石尺寸分布的金刚石涂层线切割锭时将发生的地下损伤深度成比例的参数。 该方法可以包括调整中间金刚石尺寸分布，直到产生最终的金刚石尺寸分布，其中最终金刚石尺寸分布具有基本上等于预定最大金刚石砂粒尺寸的最大金刚石砂粒尺寸，并且制造金刚石涂层线 金刚石涂层线材具有适合最终金刚石尺寸分布的多个金刚石砂粒。