公开(公告)号：US09029899B2

公开(公告)日：2015-05-12

申请号：US13399751

申请日：2012-02-17

申请人： Sung Kyoon Kim ,  Sung Ho Choo ,  Hyun Seoung Ju ,  Jae Won Seo

发明人： Sung Kyoon Kim ,  Sung Ho Choo ,  Hyun Seoung Ju ,  Jae Won Seo

IPC分类号： H01L33/62 ,  H01L41/29 ,  H01L51/50 ,  H01L33/20 ,  H01L33/38 ,  H01L33/42

CPC分类号： H01L33/20 ,  H01L33/38 ,  H01L33/42 ,  H01L2924/0002 ,  H01L2924/00

摘要： Disclosed are a light emitting device and a light emitting device package. The light emitting device includes a light emitting structure including a first conductive semiconductor layer, an active layer on the first conductive semiconductor layer, and a second conductive semiconductor layer on the active layer, a first electrode on the first conductive semiconductor layer, a transparent electrode on the second conductive semiconductor layer, and a second electrode on the transparent electrode. The first electrode includes a first electrode pad on a first region of the first conductive semiconductor layer exposed from the second conductive semiconductor layer and the active layer and a first electrode finger part extending from the first electrode pad toward a second region, in which the first conductive semiconductor layer is exposed. A gap between the transparent electrode and the first electrode finger part is gradually narrowed from the first region toward the second region.

摘要翻译： 公开了一种发光器件和发光器件封装。 发光器件包括发光结构，其包括第一导电半导体层，第一导电半导体层上的有源层和有源层上的第二导电半导体层，第一导电半导体层上的第一电极，透明电极 在第二导电半导体层上的第二电极和透明电极上的第二电极。 第一电极包括在从第二导电半导体层和有源层暴露的第一导电半导体层的第一区域上的第一电极焊盘和从第一电极焊盘朝向第二区域延伸的第一电极指部分，其中第一电极焊盘 导电半导体层被暴露。 透明电极和第一电极指部之间的间隙从第一区域朝向第二区域逐渐变窄。