公开(公告)号：US20240363800A1

公开(公告)日：2024-10-31

申请号：US18640131

申请日：2024-04-19

申请人： X Display Company Technology Limited

发明人： Carl Ray Prevatte ,  Matthew Alexander Meitl ,  Andrew Tyler Pearson ,  Christopher Andrew Bower ,  Ronald S. Cok

IPC分类号： H01L33/20 ,  H01L25/075 ,  H01L33/44

CPC分类号： H01L33/20 ,  H01L25/0753 ,  H01L33/44 ,  H01L2933/0025

摘要： A micro-component substrate structure includes a carrier substrate having a corrugated surface and a micro-component having a bottom surface disposed on the corrugated surface. Only a portion of the micro-component bottom surface is in direct contact with the corrugated surface. The micro-component can be removed from the corrugated surface using micro-transfer printing without a tether or anchor structure in the carrier substrate using a stamp with stamp posts. The corrugated surface can be coated with a film. The stamp posts and film can be PDMS and can have different adhesive qualities or areas in contact with the micro-component. The film can be processed to modify its adhesive qualities.

公开(公告)号：US20240363799A1

公开(公告)日：2024-10-31

申请号：US18579889

申请日：2021-09-29

申请人： BOE MLED Technology Co., Ltd. ,  BOE Technology Group Co., Ltd.

发明人： Yuanda LU ,  Shanwei YANG ,  Jiawei ZHAO ,  Zhijun XIONG ,  Yuanhao SUN ,  Xueqiao LI ,  Junjie MA

IPC分类号： H01L33/20 ,  H01L33/38

CPC分类号： H01L33/20 ,  H01L33/38

摘要： Provided are a light-emitting device, a light-emitting substrate and a display device. The light-emitting device includes: a substrate; a first semiconductor layer, the first semiconductor layer being located on one side of the substrate; a light-emitting layer, the light-emitting layer being located on the side of the first semiconductor layer facing away from the substrate; and a second semiconductor layer, the second semiconductor layer being located on the side of the light-emitting layer facing away from the first semiconductor layer.

公开(公告)号：US20240363794A1

公开(公告)日：2024-10-31

申请号：US18770544

申请日：2024-07-11

申请人： LG DISPLAY CO., LTD.

发明人： ChungHwan AN ,  JinWoo PARK

IPC分类号： H01L33/00 ,  H01L25/075 ,  H01L33/20

CPC分类号： H01L33/0093 ,  H01L25/0753 ,  H01L33/20

摘要： A light emitting diode transfer method includes bonding a rigid substrate on which a plurality of light emitting diodes are formed and a flexible substrate, transferring the plurality of light emitting diodes to the flexible substrate, and detaching the rigid substrate and the flexible substrate. The detaching of the rigid substrate and the flexible substrate includes separating the rigid substrate and the flexible substrate in a state in which one surface of the rigid substrate is fixed and a portion among outermost portions of the flexible substrate is fixed by a fixing member. Accordingly, it is possible to reduce transfer defects of the plurality of light emitting diodes by detaching the flexible substrate and the rigid substrate in a line-by-line separation method.

公开(公告)号：US12132147B2

公开(公告)日：2024-10-29

申请号：US17876546

申请日：2022-07-29

申请人： BOLB INC.

发明人： Jianping Zhang ,  Ying Gao ,  Ling Zhou

IPC分类号： H01L33/20 ,  H01L33/06 ,  H01L33/14 ,  H01L33/32

CPC分类号： H01L33/20 ,  H01L33/06 ,  H01L33/145 ,  H01L33/32

摘要： A patterned substrate for light emitting diode includes a plurality of nodes and links protruding from a base plane of the substrate and base areas on the substrate, each pair of adjacent nodes is connected by a corresponding link, respectively. The nodes and links also can be concave nodes and concave links cutting into a surface of the substrate, each pair of adjacent concave nodes is connected by a corresponding concave link, respectively.

公开(公告)号：US20240355987A1

公开(公告)日：2024-10-24

申请号：US18637994

申请日：2024-04-17

申请人： NICHIA CORPORATION

发明人： Masaaki KATSUMATA ,  Eiko MINATO ,  Takashi KAWAMATA ,  Atsushi HOSOKAWA

IPC分类号： H01L33/62 ,  H01L25/075 ,  H01L33/20

CPC分类号： H01L33/62 ,  H01L25/0753 ,  H01L33/20 ,  H01L2933/0066

摘要： A wiring substrate includes a base body, a metal member, and an insulating member. The base body is insulating and has a first surface and a second surface on an opposite side to the first surface. The base body includes a groove portion provided on a second surface side, and a through hole connecting the first surface and a bottom surface of the groove portion. The metal member is disposed in the groove portion on the bottom surface side of the groove portion and in the through hole away from an opening of the groove portion. The insulating member is disposed so as to close the opening of the groove portion.

公开(公告)号：US20240355965A1

公开(公告)日：2024-10-24

申请号：US18685638

申请日：2022-03-17

申请人： SONY GROUP CORPORATION

发明人： Naoki HIRAO ,  Yusuke OYAMA

IPC分类号： H01L33/20 ,  H01L25/075 ,  H01L33/60

CPC分类号： H01L33/20 ,  H01L25/0753 ,  H01L33/60

摘要： A light emitting device according to one embodiment of the present disclosure includes a first compound semiconductor layer having a first surface and a second surface that are opposed to each other, an active layer facing the second surface of the first compound semiconductor layer, a second compound semiconductor layer having a third surface that faces the active layer and a fourth surface that is opposed to the third surface and serves as a light exit surface and including one or a plurality of light collecting structures on the fourth surface, and a current narrowing structure provided within the first compound semiconductor layer or the second compound semiconductor layer.

公开(公告)号：US12100783B2

公开(公告)日：2024-09-24

申请号：US17050793

申请日：2019-04-11

申请人： OSRAM OLED GmbH

发明人： Tansen Varghese ,  Adrian Stefan Avramescu

IPC分类号： H01L21/00 ,  H01L27/15 ,  H01L33/00 ,  H01L33/20 ,  H01S5/02 ,  H01S5/04 ,  H01S5/042 ,  H01L33/16

CPC分类号： H01L33/20 ,  H01L27/156 ,  H01L33/0062 ,  H01L33/0095 ,  H01S5/0201 ,  H01S5/041 ,  H01S5/042 ,  H01L33/16 ,  H01S2304/04

摘要： An optoelectronic semiconductor body is provided with a layer stack with an active region which is configured to emit electromagnetic radiation and which includes a main extension plane, wherein the layer stack comprises side walls which extend transversely to the main extension plane of the active region, and the side walls are covered at least in places with a cover layer which is formed with at least one semiconductor material. In addition, an arrangement of a plurality of optoelectronic semiconductor bodies and a method for producing an optoelectronic semiconductor body are provided.

公开(公告)号：US12094864B2

公开(公告)日：2024-09-17

申请号：US18315758

申请日：2023-05-11

申请人： Apple Inc.

发明人： Andreas Bibl ,  Charles R. Griggs

IPC分类号： H01L25/16 ,  H01L23/00 ,  H01L25/075 ,  H01L27/02 ,  H01L27/12 ,  H01L33/00 ,  H01L33/06 ,  H01L33/08 ,  H01L33/20 ,  H01L33/30 ,  H01L33/44 ,  H01L33/48 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62

CPC分类号： H01L25/167 ,  H01L24/95 ,  H01L25/0753 ,  H01L25/165 ,  H01L27/0203 ,  H01L27/124 ,  H01L27/1244 ,  H01L33/0008 ,  H01L33/06 ,  H01L33/08 ,  H01L33/20 ,  H01L33/30 ,  H01L33/44 ,  H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/0002 ,  H01L2924/00 ,  H01L2924/12041 ,  H01L2924/00 ,  H01L2924/12042 ,  H01L2924/00 ,  H01L2924/12044 ,  H01L2924/00

摘要： Light emitting devices and methods of integrating micro LED devices into light emitting device are described. In an embodiment a light emitting device includes a reflective bank structure within a bank layer, and a conductive line atop the bank layer and elevated above the reflective bank structure. A micro LED device is within the reflective bank structure and a passivation layer is over the bank layer and laterally around the micro LED device within the reflective bank structure. A portion of the micro LED device and a conductive line atop the bank layer protrude above a top surface of the passivation layer.

公开(公告)号：US12080690B2

公开(公告)日：2024-09-03

申请号：US18507597

申请日：2023-11-13

申请人： X Display Company Technology Limited

发明人： Christopher Bower ,  Matthew Meitl ,  David Gomez ,  Salvatore Bonafede ,  David Kneeburg ,  Alin Fecioru ,  Carl Prevatte

IPC分类号： H01L25/075 ,  F21V9/08 ,  G02B26/04 ,  G02F1/167 ,  G09G3/22 ,  G09G3/32 ,  H01L23/482 ,  H01L23/538 ,  H01L25/16 ,  H01L27/15 ,  H01L33/36 ,  H01L33/38 ,  H01L33/48 ,  H01L33/50 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H05K1/03 ,  H05K1/09 ,  H05K1/18 ,  H05K5/00 ,  F21Y105/10 ,  F21Y113/13 ,  F21Y115/10 ,  H01L33/20 ,  H01L33/40

CPC分类号： H01L25/0753 ,  F21V9/08 ,  G02B26/04 ,  G02F1/167 ,  G09G3/22 ,  G09G3/32 ,  H01L23/4821 ,  H01L23/5381 ,  H01L25/167 ,  H01L27/156 ,  H01L33/36 ,  H01L33/38 ,  H01L33/385 ,  H01L33/48 ,  H01L33/50 ,  H01L33/502 ,  H01L33/508 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/181 ,  H05K1/182 ,  H05K5/0017 ,  F21Y2105/10 ,  F21Y2113/13 ,  F21Y2115/10 ,  G09G2300/0452 ,  G09G2300/0842 ,  G09G2310/0264 ,  H01L33/20 ,  H01L33/405 ,  H01L2224/18 ,  H01L2224/73267 ,  H01L2224/92244 ,  H05K2201/0329 ,  H05K2201/10106 ,  H05K2201/10128 ,  H05K2201/10166

摘要： The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 μm to 50 μm), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.

公开(公告)号：US20240258465A1

公开(公告)日：2024-08-01

申请号：US18221984

申请日：2023-07-14

申请人： LG Display Co., Ltd.

发明人： Minjae KANG ,  Dongseok LEE ,  Jusang RHIM ,  Sunghwan YOON ,  Yuseop SHIN ,  Rokhee LEE

IPC分类号： H01L33/40 ,  G09G3/32 ,  H01L23/00 ,  H01L25/16 ,  H01L33/48 ,  H01L33/62

CPC分类号： H01L33/40 ,  G09G3/32 ,  H01L24/24 ,  H01L25/167 ,  H01L33/483 ,  H01L33/62 ,  G09G2300/0842 ,  H01L33/20 ,  H01L2224/24051 ,  H01L2224/24145 ,  H01L2224/245 ,  H01L2924/0549 ,  H01L2924/12041 ,  H01L2933/0066

摘要： A display device includes a base substrate including a display area and a circuit area; a planarization layer disposed on the base substrate; a plurality of debossing grooves defined in the planarization layer and disposed on the display area of the base substrate; at least one light-emitting element aligned with and received in each of the debossing grooves, wherein the light-emitting element includes a first semiconductor layer, an active layer, a second semiconductor layer, and a first electrode contacting the first semiconductor layer; a second electrode line contacting the second semiconductor layer of the light-emitting element; and a first electrode line electrically connected to the first electrode.