公开(公告)号：US20220339920A1

公开(公告)日：2022-10-27

申请号：US17725573

申请日：2022-04-21

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： JIA-HAO WU ,  TING-I LIU ,  MENG-YING TSAI

IPC: B32B27/28 ,  B32B27/08 ,  B32B27/32 ,  B32B15/08

Abstract: A polyimide composite film for use in a flexible metal clad substrate, comprising: a polyimide base material film; a fluorine polymer layer, formed on at least one surface of the polyimide base material film, comprising polyimide resins and fluorine polymers, wherein the polyimide resin accounts for 2 to 20 wt % of the total solid content of the fluorine polymer layer, the aromatic functional group ratio of the polyimide resin in the fluorine polymer layer is greater than 35%, and the absorption onset wavelength (λonset) of the ultraviolet-visible spectrum is greater than 360 nm; a thickness ratio of the polyimide base material film to one layer of the fluorine polymer layers is 8:1 to 1:4; and a total thickness of the polyimide composite film is between 18 and 175 microns. Thus, the polyimide composite film has a low dielectric constant, low loss factor, and has good drilling processability.